ViewSonic PJ870 Service Manual - Page 66

ViewSonic PJ870 - Litebird Able Projector Manual

Page 66 highlights

PJ870 Note 10 : Window Aperture A shield is utilized on the interior perimeter of the window to improve system contrast and reduce the thermal loading caused from the overfill of incident light. The shield may be of either reflective or absorptive type. Incident light of up tp f/2.8 (input cone angle of 20° ± 10°) shall be supported without interference (active area shading) from the window aperture. The window aperture is designed to accept light at an incidence angle of 52° within the perimeter of the window. Light that falls outside the window clear aperture or outside the specified angle will have detrimental effect on system optical and thermal performance. The window aperture is depicted in Figure 7, Figure 9, and Figure 10. The packaged assembly shall accommodate incident light from the direction shown in Figure 9 and Figure 10. Section Z-Z in Figure 10 illustrates the angles and direction of the projected and dump light with incident light from the indicated direction. The edges of the package reflective shield aperture near the DMD active area shall not cause scattering of the incident or dump light to be objectionable in the projected image area. Specular reflectivity is defined for the illumination conditions in Table 2. Note 11 : Thermal Performance The DMD is designed to conduct residual heat energy to the back of the package where it can be removed by an appropriate heat sink. A device configured for a particular application can be manufactures with a thermal stud designated for that appication (see Appendix A-). The thermal stud mounting location is shown in Figure 8. The heat sink and cooling system must be capable of maintaining the package within the specified operational temperatures. The total heat load is largely driven by the incident light absorbed by the active area although other significant contributions that should be considered include light energy absorbed by the window aperture and electrical input power. The portion of incident light absorbed by the active area is determined from the active area absorption coefficient in Table 1. The absorption by the window aperture is the light neither specularly nor diffusely reflected according to the window aperture reflectvity parameters shown in Table 1. Optical systems should be designed so that no significant light energy falls outside the window clear aperture as shown in Figure 9, as any significant additional thermal load on the case top can damage the device. ViewSonic Corporation [7-6] : Confidential - Do Not Copy

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PJ870
Note
10
:
Window
Aperture
A
shield
is
utilized
on
the
interior
perimeter
of
the
window
to
improve
system
contrast
and
reduce
the
thermal
loading
caused
from
the
overfill
of
incident
light.
The
shield
may
be
of
either
reflective
or
absorptive
type.
Incident
light
of
up
tp
f/2.8
(input
cone
angle
of
20°
±
10°)
shall
be
supported
without
interference
(active
area
shading)
from
the
window
aperture.
The
window
aperture
is
designed
to
accept
light
at
an
incidence
angle
of
52°
within
the
perimeter
of
the
window.
Light
that
falls
outside
the
window
clear
aperture
or
outside
the
specified
angle
will
have
detrimental
effect
on
system
optical
and
thermal
performance.
The
window
aperture
is
depicted
in
Figure
7,
Figure
9,
and
Figure
10.
The
packaged
assembly
shall
accommodate
incident
light
from
the
direction
shown
in
Figure
9
and
Figure
10.
Section
Z
-Z
in
Figure
10
illustrates
the
angles
and
direction
of
the
projected
and
dump
light
with
incident
light
from
the
indicated
direction.
The
edges
of
the
package
reflective
shield
aperture
near
the
DMD
active
area
shall
not
cause
scattering
of
the
incident
or
dump
light
to
be
objectionable
in
the
projected
image
area.
Specular
reflectivity
is
defined
for
the
illumination
conditions
in
Table
2.
Note
11
:
Thermal
Performance
The
DMD
is
designed
to
conduct
residual
heat
energy
to
the
back
of
the
package
where
it
can
be
removed
by
an
appropriate
heat
sink.
A
device
configured
for
a
particular
application
can
be
manufactures
with
a
thermal
stud
designated
for
that
appication
(see
Appendix
A-).
The
thermal
stud
mounting
location
is
shown
in
Figure
8.
The
heat
sink
and
cooling
system
must
be
capable
of
maintaining
the
package
within
the
specified
operational
temperatures.
The
total
heat
load
is
largely
driven
by
the
incident
light
absorbed
by
the
active
area
although
other
significant
contributions
that
should
be
considered
include
light
energy
absorbed
by
the
window
aperture
and
electrical
input
power.
The
portion
of
incident
light
absorbed
by
the
active
area
is
determined
from
the
active
area
absorption
coefficient
in
Table
1.
The
absorption
by
the
window
aperture
is
the
light
neither
specularly
nor
diffusely
reflected
according
to
the
window
aperture
reflectvity
parameters
shown
in
Table
1.
Optical
systems
should
be
designed
so
that
no
significant
light
energy
falls
outside
the
window
clear
aperture
as
shown
in
Figure
9,
as
any
significant
additional
thermal
load
on
the
case
top
can
damage
the
device.
[7-6]
ViewSonic
Corporation
:
Confidential
-
Do
Not
Copy