Asus SABERTOOTH 990FX R2.0 SABERTOOTH 990FX R2.0 User's Manual - Page 16

“Ultimate COOL!” Thermal Solution, 1.1.3 “TUF ENGINE!” Power Design - difference

Page 16 highlights

Complete USB 3.0 Solution This motherboard offers you the strategic USB 3.0 accessibility for both the front and rear panels, allowing you to experience the convenience of the latest plug and play connectivity solution at speed up to ten times faster than USB 2.0. 1.1.2 "Ultimate COOL!" Thermal Solution TUF CeraM!X - Heatsink Coating Technology This feature offers better cooling solution for an overall improvement in system stability. Its innovative ceramics actively conducts heat away from the system, and replaces traditional anti-oxidant for better heat dissipation. DO NOT uninstall the heatsink module by yourself. Doing so may bend the tubing and affect the heat dissipation performance. TUF Thermal Radar The TUF Thermal Radar monitors the temperature of the motherboard's critical parts and automatically adjusts fan speeds in real time to ensure that the system remains stable and does not overheat. It consists of multiple sensors for various components, allowing you to monitor each area, while increasing options for fan control housed inside the chassis. The Thermal Radar calculates ideal fan speeds based on different parameters that you have selected for each component, keeping your system cool and more stable. 1.1.3 "TUF ENGINE!" Power Design DIGI+ Power Control DIGI+ Power Control includes multiple digital voltage controllers, allowing ultra-precise modulation and tuning of both CPU and DRAM. This innovative and industry-leading ASUS technology provides accurate voltage tuning for better efficiency, stability, and performance. Efficient Switching Power (E.S.P.) Design E.S.P., an ASUS exclusive feature, is designed for key components such as CPU, memory, graphics cards, LAN, and USB 3.0 to help improve system efficiency and reduce heat generation. TUF Components (Choke, Cap. & MOSFET; certified by military-standard) This motherboard provides rugged performance even in the most challenging conditions with its robust TUF chokes, solid capacitors, and MOSFETs, which are certified through a third-party, military-grade testing. TUF Chokes or Alloy Choke is made up of a compound of various metals instead of the standard iron, which supports up to 40A rated current, 25% higher than the standard chokes. The TUF Chokes are packaged in a single piece, eliminating the emission of vibration noise, delivering superb characteristics, and durability under extreme conditions. Chapter 1 1-2 Chapter 1: Product introduction

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1-2
Chapter 1: Product introduction
Chapter 1
Complete USB 3.0 Solution
This motherboard offers you the strategic USB 3.0 accessibility for both the front and rear
panels, allowing you to experience the convenience of the latest plug and play connectivity
solution at speed up to ten times faster than USB 2.0.
1.1.2
“Ultimate COOL!” Thermal Solution
TUF CeraM!X - Heatsink Coating Technology
This feature offers better cooling solution for an overall improvement in system stability. Its
innovative ceramics actively conducts heat away from the system, and replaces traditional
anti-oxidant for better heat dissipation.
DO NOT uninstall the heatsink module by yourself. Doing so may bend the tubing and
affect the heat dissipation performance.
TUF Thermal Radar
The TUF Thermal Radar monitors the temperature of the motherboard’s critical parts and
automatically adjusts fan speeds in real time to ensure that the system remains stable and
does not overheat. It consists of multiple sensors for various components, allowing you to
monitor each area, while increasing options for fan control housed inside the chassis. The
Thermal Radar calculates ideal fan speeds based on different parameters that you have
selected for each component, keeping your system cool and more stable.
1.1.3
“TUF ENGINE!” Power Design
DIGI+ Power Control
DIGI+ Power Control includes multiple digital voltage controllers, allowing ultra-precise
modulation and tuning of both CPU and DRAM. This innovative and industry-leading ASUS
technology provides accurate voltage tuning for better efficiency, stability, and performance.
Efficient Switching Power (E.S.P.) Design
E.S.P., an ASUS exclusive feature, is designed for key components such as CPU, memory,
graphics cards, LAN, and USB 3.0 to help improve system efficiency and reduce heat
generation.
TUF Components (Choke, Cap. & MOSFET; certified by military-standard)
This motherboard provides rugged performance even in the most challenging conditions
with its robust TUF chokes, solid capacitors, and MOSFETs, which are certified through a
third-party, military-grade testing. TUF Chokes or Alloy Choke is made up of a compound
of various metals instead of the standard iron, which supports up to 40A rated current,
25% higher than the standard chokes. The TUF Chokes are packaged in a single piece,
eliminating the emission of vibration noise, delivering superb characteristics, and durability
under extreme conditions.