HP BL260c Delivering an Adaptive Infrastructure with the HP BladeSystem c-Clas - Page 9

Modularity and scalability - proliant server blade

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• Server blades - BladeSystem c-Class supports ProLiant server blades using AMD or Intel x86 processors, Integrity IA-64 server blades, and StorageWorks storage blades. The portfolio of server blades range from extreme density-optimized blades to mainstream enterprise blades and specialized offerings for UNIX, small and medium businesses (SMB), and the HP NonStop architecture. • Interconnects - A portfolio of interconnects allow the c-Class blades to interact with external and internal storage and networking. The portfolio includes basic pass-through modules for network and storage, standard managed Ethernet and Fibre Channel switches, and Virtual Connect Modules for Ethernet and Fibre Channel, as well as both standard and specialized NICs for the blades. • Virtual Connect - HP Virtual Connect is a unique HP technology that enables virtualization, isolation, and encapsulation of multiple aspects of server, storage and networks. This is discussed in more detail in the section titled "Virtualization." Figure 4. HP BladeSystem c7000 Enclosure as viewed from the front and the rear c7000 enclosure - front Half-height server blade Full-height server blade Storage blade c7000 enclosure - rear 8 interconnect bays Single-wide or double-wide 10 U Insight Display Re dund ant fans Redundant power supplies Re dunda nt Onboard Administrators Redundant single phase, 3-phase, or -48V DC power Note: this figure shows the single phase enclosure. See the "HP BladeSystem c7000 Enclosure technologies" brief for images of the other enclosure types: http://h20000.www2.hp.com/bc/docs/support/SupportManual/c00816246/c00816246.pdf. Modularity and scalability The HP BladeSystem enclosures can accommodate half-height or full-height blades in single- or double-wide form factors, enabling customers to design the infrastructure as their needs dictate. The modular design includes common form factor components so that server blades, interconnects, and fans can be used in any c-Class enclosure, in almost any configuration that customers require. The architecture uses scalable device bays (for server or storage blades) and interconnect bays (for interconnect modules providing I/O fabric connectivity) so that administrators can scale up or scale out their BladeSystem infrastructure. A single c7000 enclosure contains 16 device bays for server, 9

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Server blades – BladeSystem c-Class supports ProLiant server blades using AMD or Intel x86
processors, Integrity IA-64 server blades, and StorageWorks storage blades. The portfolio of server
blades range from extreme density-optimized blades to mainstream enterprise blades and
specialized offerings for UNIX, small and medium businesses (SMB), and the HP NonStop
architecture.
•
Interconnects – A portfolio of interconnects allow the c-Class blades to interact with external and
internal storage and networking. The portfolio includes basic pass-through modules for network and
storage, standard managed Ethernet and Fibre Channel switches, and Virtual Connect Modules for
Ethernet and Fibre Channel, as well as both standard and specialized NICs for the blades.
•
Virtual Connect – HP Virtual Connect is a unique HP technology that enables virtualization,
isolation, and encapsulation of multiple aspects of server, storage and networks. This is discussed in
more detail in the section titled “Virtualization.”
Figure 4.
HP BladeSystem c7000 Enclosure as viewed from the front and the rear
Redundant power
supplies
Insight Display
Storage blade
Full-height
server blade
Half-height
server blade
c7000 enclosure
- front
c7000 enclosure
- rear
Redundant
single phase, 3-phase,
or
-48V DC power
8 interconnect bays
Single-wide or double-wide
Redundant
Onboard
Administrators
Redundant
fans
10 U
Note: this figure shows the single phase enclosure. See the “HP BladeSystem c7000 Enclosure technologies”
brief for images of the other enclosure types:
.
Modularity and scalability
The HP BladeSystem enclosures can accommodate half-height or full-height blades in single- or
double-wide form factors, enabling customers to design the infrastructure as their needs dictate. The
modular design includes common form factor components so that server blades, interconnects, and
fans can be used in any c-Class enclosure, in almost any configuration that customers require.
The architecture uses scalable device bays (for server or storage blades) and interconnect bays (for
interconnect modules providing I/O fabric connectivity) so that administrators can scale up or scale
out their BladeSystem infrastructure. A single c7000 enclosure contains 16 device bays for server,
9