HP Pavilion 11-n038ca HP Pavilion 11 x360 PC Maintenance and Service Guide - Page 55

The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the system

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Remove the heat sink: NOTE: You do not have to remove the fan to remove the heat sink. You must disengage the tape that secures the heat sink to the fan. 1. Following the 1 through 4 sequence stamped into the heat sink, remove the four Phillips PM2.0×3.0 screws (1) that secure the heat sink to the system board. 2. Detach the tape (2) that secures the heat sink to the fan. 3. Remove the heat sink (3). NOTE: Due to the adhesive quality of the thermal material located between the heat sink and the system board components, it may be necessary to move the heat sink from side to side to detach it. NOTE: The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the system board components each time the heat sink is removed. Thermal paste is used on the processor (1) and the heat sink section (2) that services it Component replacement procedures 47

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Remove the heat sink:
NOTE:
You do not have to remove the fan to remove the heat sink. You must disengage the tape that
secures the heat sink to the fan.
1.
Following the 1 through 4 sequence stamped into the heat sink, remove the four Phillips PM2.0×3.0
screws
(1)
that secure the heat sink to the system board.
2.
Detach the tape
(2)
that secures the heat sink to the fan.
3.
Remove the heat sink
(3)
.
NOTE:
Due to the adhesive quality of the thermal material located between the heat sink and the
system board components, it may be necessary to move the heat sink from side to side to detach it.
NOTE:
The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the system
board components each time the heat sink is removed. Thermal paste is used on the processor
(1)
and the
heat sink section
(2)
that services it
Component replacement procedures
47