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Intel VC820 Design Guide - Page 20

Platform Initiatives, 1.4.1 Direct Rambus*, 1.4.2 Streaming SIMD Extensions, 1.4.3 AGP 2.0

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Introduction 1.4 1.4.1 1.4.2 1.4.3 1.4.4 Platform Initiatives Direct Rambus* The Direct Rambus* (RDRAM) initiative provides the memory bandwidth necessary to obtain optimal performance from the Pentium III processor as well as a high-performance AGP graphics controller. The MCH RDRAM interface supports 266 MHz, 300 MHz, 356 MHz, and 400 MHz operation; the latter delivers 1.6 GB/s of theoretical memory bandwidth; twice the memory bandwidth of 100 MHz SDRAM systems. Coupled with the greater bandwidth, the RDRAM protocol, which is heavily pipelined, provides substantially more efficient data transfer. The RDRAM memory interface can achieve greater than 95% utilization of the 1.6 GB/s theoretical maximum bandwidth. In addition to RDRAM's performance features, the new memory architecture provides enhanced power management capabilities. The powerdown mode of operation enables Intel® 820 chipset based systems to cost-effectively support suspend-to-RAM. Streaming SIMD Extensions The Pentium III processor provides 70 new Streaming SIMD (single instruction, multiple data) Extensions. The Pentium III new extensions are floating point SIMD extensions. Intel MMX™ technology provides integer SIMD extensions. The Pentium III processor new extensions complement the Intel MMX™ technology SIMD extensions and provide a performance boost to floating-point intensive 3D applications. AGP 2.0 The AGP 2.0 interface, along with Direct Rambus* memory technology, allows graphics controllers to access main memory at over 1 GB/s; twice the AGP bandwidth of previous AGP platforms. AGP 2.0 provides the infrastructure necessary for photorealistic 3D. In conjunction with Direct Rambus* and the Pentium III processor new Streaming SIMD Extensions, AGP 2.0 delivers the next level of 3D graphics performance. Hub Interface As I/O speeds increase, the demand placed on the PCI bus by the I/O bridge has become significant. With the addition of AC'97 and ATA/66, coupled with the existing USB, I/O requirements will begin to impact PCI bus performance. The Intel® 820 chipset's hub interface architecture ensures that the I/O subsystem, both PCI and the integrated I/O features (IDE, AC'97, USB, etc.), receives adequate bandwidth. By placing the I/O bridge on the hub interface instead of PCI, the hub architecture ensures that both the I/O functions integrated into the ICH and the PCI peripherals obtain the bandwidth necessary for peak performance. In addition, the hub interface's lower pin count allows a smaller package for the MCH and ICH. 1-8 Intel®820 Chipset Design Guide

Section	Page
Introduction 1	13
1.1 About This Design Guide	13
1.2 References	14
1.3 System Overview	14
1.3.1 Chipset Components	15
1.3.2 Bandwidth Summary	16
1.3.3 System Configuration	17
1.4 Platform Initiatives	20
1.4.1 Direct Rambus*	20
1.4.2 Streaming SIMD Extensions	20
1.4.3 AGP 2.0	20
1.4.4 Hub Interface	20
1.4.5 Manageability	21
1.4.6 AC’97	22
1.4.7 Low Pin Count (LPC) Interface	23
Layout/Routing Guidelines 2	27
2.1 General Recommendations	27
2.2 Component Quadrant Layout	27
2.3 Intel® 820 Chipset Component Placement	29
2.4 Core Chipset Routing Recommendations	30
2.5 Source Synchronous Strobing	31
2.6 Direct Rambus* Interface	33
2.6.1 Stackup	34
2.6.2 Direct Rambus* Layout Guidelines	34
2.6.2.1 RSL Routing	34
2.6.2.2 RSL Termination	37
2.6.2.3 Direct Rambus* Ground Plane Reference	39
2.6.2.4 Direct Rambus* Connector Compensation	40
2.6.2.5 RSL Signal Layer Alternation	46
2.6.2.6 Length Matching Methods	47
2.6.2.7 VIA Compensation	49
2.6.2.8 Length Matching & Via Compensation Example	49
2.6.3 Direct Rambus* Reference Voltage	51
2.6.4 High-speed CMOS Routing	51
2.6.4.1 SIO Routing	52
2.6.4.2 Suspend-to-RAM Shunt Transistor	52
2.6.5 Direct Rambus* Clock Routing	54
2.6.6 Direct Rambus* Design Checklist	54
2.7 AGP 2.0	57
2.7.1 AGP Interface Signal Groups	58
2.7.2 1X Timing Domain Routing Guidelines	59
2.7.3 2X/4X Timing Domain Routing Guidelines	59
2.7.4 AGP 2.0 Routing Summary	61
2.7.5 AGP Clock Routing	62
2.7.6 General AGP Routing Guidelines	62
2.7.7 VDDQ Generation and TYPEDET#	63
2.7.8 VREF Generation for AGP 2.0 (2X and 4X)	65
2.7.9 Compensation	67
2.7.10 AGP Pull-ups	67
2.7.10.1 AGP Signal Voltage Tolerance List	68
2.7.11 Motherboard / Add-in Card Interoperability	68
2.8 Hub Interface	69
2.8.1 Data Signals	70
2.8.2 Strobe Signals	70
2.8.3 HREF Generation/Distribution	70
2.8.4 Compensation	71
2.9 System Bus Design	72
2.9.1 100/133 MHz System Bus	72
2.9.2 System Bus Ground Plane Reference	73
2.10 S.E.C.C. 2 Grounding Retention Mechanism (GRM)	73
2.11 Processor CMOS Pullup Values	75
2.12 Additional Host Bus Guidelines	78
2.13 Ultra ATA/66	82
2.13.1 Ultra ATA/66 Detection	82
2.13.2 Ultra ATA/66 Cable Detection	83
2.13.3 Ultra ATA/66 Pullup/Pulldown Requirements	86
2.14 AC’97	87
2.14.1 AC’97 Signal Quality Requirements	89
2.14.2 AC’97 Motherboard Implementation	89
2.15 USB	91
2.16 ISA (82380AB)	92
2.16.1 ICH GPIO connected to 82380AB	92
2.16.2 Sub Class Code	92
2.17 IOAPIC Design Recommendation	92
2.18 SMBus/Alert Bus	93
2.19 PCI	93
2.20 RTC	93
2.20.1 RTC Crystal	94
2.20.2 External Capacitors	94
2.20.3 RTC Layout Considerations	95
2.20.4 RTC External Battery Connection	95
2.20.5 RTC External RTCRST Circuit	96
2.20.6 RTC Routing Guidelines	96
2.20.7 VBIAS DC Voltage and Noise Measurements	97
Advanced System Bus Design 3	101
3.1 Terminology and Definitions	101
3.2 AGTL+ Design Guidelines	104
3.2.1 Initial Timing Analysis	105
3.2.2 Determine General Topology, Layout, and Routing Desired	108
3.2.3 Pre-Layout Simulation	108
3.2.3.1 Methodology	108
3.2.3.2 Sensitivity Analysis	108
3.2.3.3 Monte Carlo Analysis	109
3.2.3.4 Simulation Criteria	109
3.2.4 Place and Route Board	110
3.2.4.1 Estimate Component To Component Spacing for AGTL+ Signals	110
3.2.4.2 Layout and Route Board	110
3.2.4.3 Host Clock Routing	112
3.2.4.4 APIC Data Bus Routing	112
3.2.5 Post-Layout Simulation	113
3.2.5.1 Intersymbol Interference	113
3.2.5.2 Cross-Talk Analysis	113
3.2.5.3 Monte Carlo Analysis	113
3.2.6 Validation	114
3.2.6.1 Measurements	114
3.2.6.2 Flight Time Simulation	114
3.2.6.3 Flight Time Hardware Validation	115
3.3 Theory	115
3.3.1 AGTL+	115
3.3.2 Timing Requirements	116
3.3.3 Cross-talk Theory	116
3.3.3.1 Potential Termination Cross-Talk Problems	118
3.4 More Details and Insight	119
3.4.1 Textbook Timing Equations	119
3.4.2 Effective Impedance and Tolerance/Variation	120
3.4.3 Power/Reference Planes, PCB Stackup, and High Frequency Decoupling	120
3.4.3.1 Power Distribution	120
3.4.3.2 Reference Planes and PCB Stackup	121
3.4.3.3 High Frequency Decoupling	122
3.4.3.4 SC242 Connector	123
3.4.4 Clock Routing	123
3.5 Definitions of Flight Time Measurements/ Corrections and Signal Quality	124
3.5.1 VREF Guardband	124
3.5.2 Ringback Levels	124
3.5.3 Overdrive Region	124
3.5.4 Flight Time Definition and Measurement	125
3.6 Conclusion	126
Clocking 4	129
4.1 Clock Generation	129
4.2 Component Placement and Interconnection Layout Requirements	134
4.2.1 14.318MHz Crystal to CK133	134
4.2.2 CK133 to DRCG	134
4.2.3 MCH to DRCG	135
4.2.4 DRCG to RDRAM Channel	136
4.2.5 Trace Length	136
4.3 DRCG Impedance Matching Circuit	138
4.3.1 DRCG Layout Example	139
4.4 AGP Clock Routing Guidelines	139
4.5 Series Termination Resistors for CK133 Clock Outputs	139
4.6 Unused Outputs	140
4.7 Decoupling Recommendation for CK133 and DRCG	140
4.8 DRCG Frequency Selection and the DRCG+	140
4.8.1 DRCG Frequency Selection Table and Jitter Specification	140
4.8.2 DRCG+ Frequency Selection Schematic	141
System Manufacturing 5	145
5.1 In Circuit FWH Flash BIOS Programming	145
5.2 FWH Flash BIOS Vpp Design Guidelines	145
5.3 Stackup Requirement	145
5.3.1 Overview	145
5.3.2 PCB Materials	146
5.3.3 Design Process	146
5.3.4 Test Coupon Design Guidelines	147
5.3.5 Recommended Stackup	147
5.3.6 Inner Layer Routing	147
5.3.7 Impedance Calculation Tools	148
5.3.8 Testing Board Impedance	148
5.3.9 Board Impedance/Stackup Summary	149
System Design Considerations 6	153
6.1 Power Delivery	153
6.1.1 Terminology and Definitions	153
6.1.2 Intel® 820 Chipset Customer Reference Board Power Delivery	154
6.1.3 64/72Mbit RDRAM Excessive Power Consumption	157
6.1.3.1 Option 1: Reduce the Clock Frequency During Initialization	158
6.1.3.2 Option 2: Increase the Current Capability of the 2.5V Voltage Regulator	158
6.2 Power Plane Splits	159
6.3 Thermal Design Power	159
6.4 Glue Chip 3 (Intel® 820 Chipset Glue Chip)	160
Appendix A: Reference Board Schematics: Uni-Processor	161
Reference Design Schematics: Uni-Processor A	163
Appendix B: Reference Design Schematics: Dual-Processor B	201

Match case Limit results 1 per page

Introduction

1-8

Intel

820 Chipset

Design Guide

1.4

Platform Initiatives

1.4.1

Direct Rambus

The Direct Rambus

(RDRAM) initiative provides the memory bandwidth necessary to obtain

optimal performance from the Pentium

III

processor as well as a high-performance AGP graphics

controller. The MCH RDRAM interface supports 266 MHz, 300 MHz, 356 MHz, and 400 MHz

operation; the latter delivers 1.6 GB/s of theoretical memory bandwidth; twice the memory

bandwidth of 100 MHz SDRAM systems. Coupled with the greater bandwidth, the RDRAM

protocol, which is heavily pipelined, provides substantially more efficient data transfer. The

RDRAM memory interface can achieve greater than 95% utilization of the 1.6 GB/s theoretical

maximum bandwidth.

In addition to RDRAM’s performance features, the new memory architecture provides enhanced

power management capabilities. The

powerdown

mode of operation enables Intel

820 chipset

based systems to cost-effectively support

suspend-to-RAM

1.4.2

Streaming SIMD Extensions

The Pentium

III

processor provides 70 new Streaming SIMD (single instruction, multiple data)

Extensions. The Pentium

III

new extensions are floating point SIMD extensions. Intel MMX™

technology provides integer SIMD extensions. The Pentium

III

processor new extensions

complement the Intel MMX™ technology SIMD extensions and provide a performance boost to

floating-point intensive 3D applications.

1.4.3

AGP 2.0

The AGP 2.0 interface, along with Direct Rambus

memory technology, allows graphics

controllers to access main memory at over 1 GB/s; twice the AGP bandwidth of previous AGP

platforms. AGP 2.0 provides the infrastructure necessary for

photorealistic 3D.

In conjunction with

Direct Rambus

and the Pentium

III

processor new Streaming SIMD Extensions, AGP 2.0 delivers

the next level of 3D graphics performance.

1.4.4

Hub Interface

As I/O speeds increase, the demand placed on the PCI bus by the I/O bridge has become

significant. With the addition of AC’97 and ATA/66, coupled with the existing USB, I/O

requirements will begin to impact PCI bus performance. The Intel

820 chipset’s hub interface

architecture ensures that the I/O subsystem, both PCI and the integrated I/O features (IDE, AC’97,

USB, etc.), receives adequate bandwidth. By placing the I/O bridge on the hub interface instead of

PCI, the hub architecture ensures that both the I/O functions integrated into the ICH and the PCI

peripherals obtain the bandwidth necessary for peak performance. In addition, the hub interface’s

lower pin count allows a smaller package for the MCH and ICH.