Dell PowerEdge M1000e Technical Guide - Page 3

Table of Contents - power consumption

Page 3 highlights

Dell Table of Contents 1 Product Comparison 5 2 New Technologies 7 2.1 Overview 7 2.2 Detailed Information 7 3 System Information 9 3.1 Overview 9 3.2 Product Features Summary 9 4 Mechanical ...10 4.1 Chassis Description 10 4.2 Dimensions and Weight 10 4.3 Front Panel View and Features 10 4.4 Back Panel Features 12 4.5 Power Supply Indicators 12 4.6 Rails and Cable Management 13 4.7 Rack Support 16 4.8 Rack View 16 4.9 Fans ...17 4.10 Cabling 21 4.11 Control Panel/LCD 22 4.12 Security 24 5 Power, Thermal, Acoustic 26 5.1 Power Supplies 26 5.1.1 Supported Voltages 27 5.1.2 Redundancy 27 5.1.3 Power Management 29 5.2 Power Supply Specifications 30 5.3 Heat Dissipation 30 5.4 Environmental Specifications 33 5.5 Power Consumption 33 5.6 Maximum Input Amps 33 5.7 Power-Up Sequence 33 5.8 Acoustics 33 6 Processors and Memory 35 7 Midplane...36 8 Embedded NICs/LAN on Motherboard (LOM 39 9 I/O ...40 9.1 Overview 40 9.2 Quantities and Priorities 41 9.3 Supported Mezzanine Cards and Switches 44 9.4 I/O Module Installation 45 9.5 FlexAddress 45 10 Storage ...51 11 Video...52 12 Rack Information 53 PowerEdge M1000e Technical Guide 2

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Dell
PowerEdge M1000e Technical Guide
2
Table of Contents
1
Product Comparison
...........................................................................................
5
2
New Technologies
..............................................................................................
7
2.1
Overview
..................................................................................................
7
2.2
Detailed Information
....................................................................................
7
3
System Information
............................................................................................
9
3.1
Overview
..................................................................................................
9
3.2
Product Features Summary
.............................................................................
9
4
Mechanical
....................................................................................................
10
4.1
Chassis Description
.....................................................................................
10
4.2
Dimensions and Weight
................................................................................
10
4.3
Front Panel View and Features
......................................................................
10
4.4
Back Panel Features
...................................................................................
12
4.5
Power Supply Indicators
...............................................................................
12
4.6
Rails and Cable Management
.........................................................................
13
4.7
Rack Support
............................................................................................
16
4.8
Rack View
...............................................................................................
16
4.9
Fans
......................................................................................................
17
4.10
Cabling
...................................................................................................
21
4.11
Control Panel/LCD
.....................................................................................
22
4.12
Security
..................................................................................................
24
5
Power, Thermal, Acoustic
..................................................................................
26
5.1
Power Supplies
.........................................................................................
26
5.1.1
Supported Voltages
..............................................................................
27
5.1.2
Redundancy
.......................................................................................
27
5.1.3
Power Management
..............................................................................
29
5.2
Power Supply Specifications
..........................................................................
30
5.3
Heat Dissipation
........................................................................................
30
5.4
Environmental Specifications
.........................................................................
33
5.5
Power Consumption
....................................................................................
33
5.6
Maximum Input Amps
..................................................................................
33
5.7
Power-Up Sequence
...................................................................................
33
5.8
Acoustics
................................................................................................
33
6
Processors and Memory
.....................................................................................
35
7
Midplane
.......................................................................................................
36
8
Embedded NICs/LAN on Motherboard (LOM)
.............................................................
39
9
I/O
.............................................................................................................
40
9.1
Overview
................................................................................................
40
9.2
Quantities and Priorities
..............................................................................
41
9.3
Supported Mezzanine Cards and Switches
..........................................................
44
9.4
I/O Module Installation
................................................................................
45
9.5
FlexAddress
.............................................................................................
45
10
Storage
........................................................................................................
51
11
Video
...........................................................................................................
52
12
Rack Information
.............................................................................................
53