Dell PowerEdge XE2420 EMC Technical Specifications - Page 19

• Processor with TDP=150 W and 8 cores is supported to ASHRAE A2 when turbo boost is disabled. • Processor with TDP=150 W and 8 cores, with turbo boost will have over temperature event at 35°C ambient temperature. This is because the CPU's power consumption is instantly raised up to 160 W to 170 W. • PCIe card with TDP greater than 25 W is not supported. • Single PSU failure is not supported. Two PSUs are required in redundant mode. Particulate and gaseous contamination specifications The following table defines the limitations that help avoid any damages to the IT equipment and/or, or both failure from particulate and gaseous contamination. If the levels of particulate or gaseous pollution exceed the specified limitations and results in equipment damage or failure, you must rectify the environmental conditions. Remediation of environmental conditions is the responsibility of the customer. Table 25. Particulate contamination specifications Particulate contamination Air filtration Specifications Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a 95% upper confidence limit. NOTE: This condition applies to data center environments only. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. NOTE: Air entering the data center must have MERV11 or MERV13 filtration. NOTE: Air filtering can also be accomplished by filtering room air with MERV8 filter per ANSI/ASHARE Standard 127. Conductive dust Air must be free of conductive dust, zinc whiskers, or other conductive particles. NOTE: This condition applies to data center and nondata center environments. NOTE: Common sources of conductive dust include manufacturing processes, and zinc whiskers from the plating on the bottom of raised floor tiles. Corrosive dust • Air must be free of corrosive dust. • Any remaining dust present in the air shall have a deliquescent point less than 60% relative humidity. NOTE: This condition applies to data center and nondata center environments. Table 26. Gaseous contamination specifications Gaseous contamination Copper Coupon Corrosion rate Silver Coupon Corrosion rate Specifications