Foxconn H77M-S User manual - Page 9
Product Specifications, Dual channel DDR3 1066/1333/1600 MHz architecture - lga 1155 h77 ddr3
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1 1-1 Product Specifications CPU Chipset Memory Expansion Slot Storage LAN Audio USB Internal Connectors Support Intel Ivy Bridge/Sandy Bridge LGA 1155 Processors, Max processor power up to 95W For the latest CPU information, please visit: http://www.foxconnsupport.com/cpusupportlist.aspx Intel® H77 4 x 240-pin DDR3 DIMMs Support up to 32GB of system memory Dual channel DDR3 1066/1333/1600 MHz architecture 1 x PCI Express x 16 slot 1 x PCI Express x1 slot 2 x PCI slots H77 chipset: - 4 x SATA 2.0 connectors (3Gb/s data transfer rate) - 2 x SATA 3.0 connectors (6Gb/s data transfer rate) RTL8111E colay RTL8105E Realtek ALC662/ ALC888S Audio chip: - High Definition Audio - 2/4/5.1-channel (H77M) - 2/4/5.1/7.1-channel (H77M-S) - Support Jack-Sensing function H77 chipset: - Support up to 10 x USB 2.0 ports (6 rear panel ports, 2 onboard USB headers supporting 4 extra ports) - Support up to 4 x USB 3.0 ports (2 rear panel ports, 1 onboard USB headers supporting 2 extra ports) - Support USB 2.0 protocol up to 480Mb/s - Support USB 3.0 protocol up to 5Gbs 1 x 24-pin ATX main power connector 1 x 4-pin ATX 12V power connector 4 x SATA 2.0 connectors 2 x SATA 3.0 connectors 2 x USB 2.0 headers (supporting 4 x USB devices) 1 x USB 3.0 header (supporting 2 x USB devices) 1 x CPU fan header (4-pin) 2 x System fan headers (4-pin) 1 x Front panel header 1 x Front audio header (Continued next page)