HP 2000-2d20ca HP 2000 Notebook PC and Compaq CQ58 Notebook PC - Maintenance a - Page 101
The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the system board
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The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the system board components each time the heat sink is removed. Replacement thermal materials are included with the fan/ heat sink assembly, processor, and system board spare part kits. NOTE: The following illustration shows the replacement thermal material locations on a computer model equipped with an AMD processor. ENWW Component replacement procedures 93
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The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the system board
components each time the heat sink is removed. Replacement thermal materials are included with the fan/
heat sink assembly, processor, and system board spare part kits.
NOTE:
The following illustration shows the replacement thermal material locations on a computer model
equipped with an AMD processor.
ENWW
Component replacement procedures
93