Home » HP Manuals » Desktops » HP DC5100 » Manual Viewer

HP DC5100 HP Compaq Business Desktop dc5100 Service Reference Guide, 2nd Editi - Page 224

DIMM Sockets, labeled XMM1, XMM2, and XMM4. Sockets XMM1 and XMM2 operate in memory

UPC - 072000919491

Add to My Manuals
Save this manual to your list of manuals

Page 224 highlights

DIMM Sockets There are four DIMM sockets on the system board, with two sockets per channel. The sockets are labeled XMM1, XMM2, XMM3, and XMM4. Sockets XMM1 and XMM2 operate in memory channel A. Sockets XMM3 and XMM4 operate in memory channel B. The system board shown may differ from the one in your product. Item 1 2 DIMM Socket Socket Color Item 3 4 DIMM Socket Socket Color The system will automatically operate in single channel mode, dual channel Asymmetric mode, or a a higher-performing dual channel Interleaved mode, depending on how the DIMMs are installed. The system will operate in single channel mode if the DIMM sockets are populated in one channel only. The system will operate in dual channel Asymmetric mode if the total memory capacity of the DIMMs in Channel A is not equal to the total memory capacity of the DIMMs in Channel B. The system will operate in a higher-performing dual channel Interleaved mode if the total memory capacity of the DIMMs in Channel A is equal to the total memory capacity of the DIMMs in Channel B. However, the technology and device width can vary between the channels, For example, if Channel A is populated with two 256 MB DIMMS and Channel B is populated with one 512 MB DIMM, the system will operate in Interleaved mode. In any mode, the maximum operational speed is determined by the slowest DIMM in the system. For example, if the system is populated with a DIMM that is 400 MHz and a second DIMM that is 533 MHz, the system will run at the slower of the two speeds.

Section	Page
Service Reference Guide Cover Page	1
Contents	3
Chapter 1	7
1.1 Installing or Upgrading Device Drivers	7
1.2 Transferring Files and Settings	8
1.3 Backing Up and Restoring Files	8
1.3.1 Creating a Backup File-Windows XP Professional	8
1.3.2 Restoring from the Backup File-Windows XP Professional	8
1.4 Converting to NTFS	8
1.5 HP Software	8
Chapter 2	11
2.1 Power-On Self-Test (POST)	11
2.2 Computer Setup Utilities	12
2.2.1 Using Computer Setup (F10) Utilities	13
2.2.2 Computer Setup Menu	14
2.3 Diagnostics for Windows	24
2.3.1 Detecting Diagnostics for Windows	25
2.3.2 Installing Diagnostics for Windows	25
2.3.3 Using Categories in Diagnostics for Windows	26
2.3.4 Running Diagnostic Tests in Diagnostics for Windows	27
2.4 Configuration Record	28
2.4.1 Installing Configuration Record	29
2.4.2 Running Configuration Record	29
Chapter 3	31
3.1 Initial Configuration and Deployment	31
3.2 Remote System Installation	32
3.3 Software Updating and Management	32
3.3.1 HP Client Manager Software	32
3.3.2 Altiris Client Management Solutions	33
3.3.3 System Software Manager	33
3.3.4 Proactive Change Notification (PCN)	34
3.3.5 Subscriber’s Choice	34
3.3.6 ROM Flash	34
3.3.7 Remote ROM Flash	34
3.3.8 HPQFlash	35
3.3.9 FailSafe Boot Block ROM	35
3.3.10 Replicating the Setup	36
3.3.11 Dual-State Power Button	42
3.3.12 World Wide Web Site	42
3.3.13 Building Blocks and Partners	42
3.4 Asset Tracking and Security	43
3.4.1 Password Security	47
3.4.2 Establishing a Setup Password Using Computer Setup	47
3.4.3 Establishing a Power-On Password Using Computer Setup	47
3.4.4 DriveLock	50
3.4.5 Smart Cover Sensor	52
3.4.6 Master Boot Record Security	54
3.4.7 Before You Partition or Format the Current Bootable Disk	55
3.4.8 Cable Lock Provision	55
3.4.9 Fingerprint Identification Technology	55
3.5 Fault Notification and Recovery	56
3.5.1 Drive Protection System	56
3.5.2 Surge-Tolerant Power Supply	56
3.5.3 Thermal Sensor	56
Chapter 4	57
4.1 SATA and PATA Device Information	57
4.2 ATA Cables	58
4.2.1 SATA Data Cable	58
4.2.2 SATA Power Cable	58
4.2.3 PATA Data Cable	59
4.2.4 PATA Power Cable	59
4.2.5 PATA Cable Layout	60
4.3 PATA Drive Installation Guidelines	61
4.3.1 PATA Device Classes	61
4.3.2 PATA Attach Sequence Rules by Class Priority	62
4.3.3 PATA Attach Sequence Worksheet	63
4.3.4 PATA Additional Drive Application Notes	65
4.4 ATA SMART Drives	66
4.5 Drive Capacities	66
4.6 SATA BIOS	67
4.6.1 Legacy Mode	67
4.6.2 Native Mode	67
4.7 Mixed Devices Boot and Drive Letter Ordering	68
Chapter 5	69
5.1 Chassis Designations	69
5.1.1 Microtower (MT)	69
5.1.2 Small Form Factor (SFF)	70
5.2 Electrostatic Discharge Information	71
5.2.1 Generating Static	71
5.2.2 Preventing Electrostatic Damage to Equipment	71
5.2.3 Personal Grounding Methods and Equipment	72
5.2.4 Grounding the Work Area	72
5.2.5 Recommended Materials and Equipment	72
5.3 Operating Guidelines	73
5.4 Routine Care	73
5.4.1 General Cleaning Safety Precautions	73
5.4.2 Cleaning the Computer Case	74
5.4.3 Cleaning the Keyboard	74
5.4.4 Cleaning the Monitor	75
5.4.5 Cleaning the Mouse	75
5.5 Service Considerations	75
5.5.1 Power Supply Fan	75
5.5.2 Tools and Software Requirements	75
5.5.3 Screws	76
5.5.4 Cables and Connectors	76
5.5.5 Hard Drives	76
5.5.6 Lithium Coin Cell Battery	77
Chapter 6. Removal and Replacement Procedures- Microtower (MT) Chassis	79
6.1 Preparation for Disassembly	79
6.2 External Security Devices	80
6.2.1 Installing a Cable Lock	80
6.2.2 Installing a Padlock	80
6.3 Access Panel	81
6.4 Front Bezel	82
6.5 Front Drive Bezels	84
6.5.1 5.25\	84
6.5.2 Diskette Drive Bezel	85
6.5.3 3.5\	85
6.6 Memory Modules	86
6.7 Expansion Cards	87
6.7.1 Expansion Slot Cover	87
6.7.2 PCI Expansion Card	88
6.8 Cable Management	90
6.8.1 Cable Connections	91
6.9 Drives	92
6.9.1 Drive Positions	92
6.9.2 Removing a Drive	93
Disconnecting Optical Drive Cables	93
Disconnecting Diskette Drive Cables	93
Disconnecting Hard Drive Cables	94
Releasing the Drives	94
6.9.3 Installing a Drive	95
Connecting Optical Drive Cables	96
Connecting Diskette Drive Cables	96
Connecting Hard Drive Cables	97
6.10 Chassis Fan	98
6.11 Front I/O Panel Housing Assembly	99
6.12 Front I/O Devices	100
6.13 Power Switch Assembly	101
6.14 Heatsink	102
6.15 Processor	103
6.16 System Board	105
6.17 Battery	106
6.17.1 Type 1 Battery Holder	107
6.17.2 Type 2 Battery Holder	108
6.17.3 Type 3 Battery Holder	109
6.18 Speaker	110
6.19 Power Supply	111
Chapter 7. Removal and Replacement Procedures- Small Form Factor (SFF) Chassis	113
7.1 Preparation for Disassembly	113
7.2 Unlocking the Smart Cover Lock	114
7.3 External Security Devices	116
7.3.1 Security Clip	116
7.3.2 Cable Lock	116
7.3.3 Padlock	117
7.3.4 Universal Chassis Clamp Lock	117
7.4 Computer Cover	122
7.5 Front Drive Bezels	123
7.6 Cable Management	125
7.6.1 Cable Connections	127
7.7 Memory	128
7.8 Expansion Card	130
7.8.1 Expansion Card Retainer	130
7.8.2 PCI Expansion Card	131
7.9 Drives	133
7.9.1 Drive Positions	133
7.9.2 Optical Drive	134
7.9.3 External 3.5-inch Drive	136
7.9.4 Primary Hard Drive	137
7.10 Fan Shroud	141
7.11 Front I/O Devices	142
7.12 Power Switch Assembly	146
7.13 Heatsink	147
7.14 Processor	148
7.15 Speaker	150
7.16 Power Supply	151
7.17 System Board	153
7.18 Chassis Fan	158
7.19 Battery	159
7.19.1 Type 1 Battery Holder	160
7.19.2 Type 2 Battery Holder	161
7.19.3 Type 3 Battery Holder	162
A. Connector Pin Assignments	163
B. Power Cord Set Requirements	173
C. POST Error Messages	175
D. Troubleshooting Without DIagnostics	185
E. System Board and Riser card Reference Designators	219
F. Memory	223

Match case Limit results 1 per page

DIMM Sockets

There are four DIMM sockets on the system board, with two sockets per channel. The sockets are

labeled XMM1, XMM2, XMM3, and XMM4. Sockets XMM1 and XMM2 operate in memory

channel A. Sockets XMM3 and XMM4 operate in memory channel B.

The system board shown may differ from the one in your product.

The system will automatically operate in single channel mode, dual channel Asymmetric mode,

or a a higher-performing dual channel Interleaved mode, depending on how the DIMMs are

installed.

The system will operate in single channel mode if the DIMM sockets are populated in one

channel only.

The system will operate in dual channel Asymmetric mode if the total memory capacity of

the DIMMs in Channel A is not equal to the total memory capacity of the DIMMs in

Channel B.

The system will operate in a higher-performing dual channel Interleaved mode if the total

memory capacity of the DIMMs in Channel A is equal to the total memory capacity of the

DIMMs in Channel B. However, the technology and device width can vary between the

channels, For example, if Channel A is populated with two 256 MB DIMMS and Channel B

is populated with one 512 MB DIMM, the system will operate in Interleaved mode.

In any mode, the maximum operational speed is determined by the slowest DIMM in the

system. For example, if the system is populated with a DIMM that is 400 MHz and a second

DIMM that is 533 MHz, the system will run at the slower of the two speeds.

Item

DIMM Socket

Socket Color

Item

DIMM Socket

Socket Color