HP ENVY TouchSmart 15-q100 ENVY m6 Notebook PC ENVY Notebook PC Maintenance an - Page 69

heat sink, processor, and system board spare part kits. Thermal paste is used on the processor

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3. Remove the heat sink (2). NOTE: Due to the adhesive quality of the thermal material located between the heat sink and the system board components, it may be necessary to move the heat sink from side to side to detach it. NOTE: The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the system board components each time the heat sink is removed. Replacement thermal material is included with the heat sink, processor, and system board spare part kits. Thermal paste is used on the processor (1) and the heat sink section (2) that services it. Component replacement procedures 61

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3.
Remove the heat sink
(2)
.
NOTE:
Due to the adhesive quality of the thermal material located between the heat sink and the
system board components, it may be necessary to move the heat sink from side to side to detach it.
NOTE:
The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the system
board components each time the heat sink is removed. Replacement thermal material is included with the
heat sink, processor, and system board spare part kits. Thermal paste is used on the processor
(1)
and the
heat sink section
(2)
that services it.
Component replacement procedures
61