HP ENVY m6-1205dx HP ENVY m6 Notebook PC Maintenance and Service Guide - Page 88

Thermal paste is used on the processor, equipped with a graphics subsystem with discrete memory.

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3. Following the 1, 2, 3, 4 sequence stamped into the heat sink, loosen the four captive Philllips screws (1) that secure the heat sink to the system board, and then remove the heat sink (2). NOTE: Due to the adhesive quality of the thermal material located between the heat sink and the system board components, it may be necessary to move the heat sink from side to side to detach it. NOTE: The following illustration shows the heat sink removal process for a computer model equipped with an AMD processor. The process for removing the heat sink on a computer model equipped with an Intel processor is identical. NOTE: The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the system board components each time the heat sink is removed. Replacement thermal material is included with the heat sink, processor, and system board spare part kits. The following illustration shows the replacement thermal material locations on a computer model equipped with a graphics subsystem with discrete memory. ● Thermal paste is used on the processor (1) and the heat sink section (2) that services it ● Thermal paste is used on the graphics subsystem chip (3) and the heat sink section (4) that services it 80 Chapter 4 Removal and replacement procedures

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3.
Following the 1, 2, 3, 4 sequence stamped into the heat sink, loosen the four captive Philllips
screws
(1)
that secure the heat sink to the system board, and then remove the heat sink
(2)
.
NOTE:
Due to the adhesive quality of the thermal material located between the heat sink and
the system board components, it may be necessary to move the heat sink from side to side to
detach it.
NOTE:
The following illustration shows the heat sink removal process for a computer model
equipped with an AMD processor. The process for removing the heat sink on a computer model
equipped with an Intel processor is identical.
NOTE:
The thermal material must be thoroughly cleaned from the surfaces of the heat sink and
the system board components each time the heat sink is removed. Replacement thermal material is
included with the heat sink, processor, and system board spare part kits.
The following illustration shows the replacement thermal material locations on a computer model
equipped with a graphics subsystem with discrete memory.
●
Thermal paste is used on the processor
(1)
and the heat sink section
(2)
that services it
●
Thermal paste is used on the graphics subsystem chip
(3)
and the heat sink section
(4)
that
services it
80
Chapter 4
Removal and replacement procedures