HP ML150 Optimizing facility operation in high density data center environment - Page 1

HP ML150 - ProLiant - G6 Manual

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Optimizing facility operation in high density data center environments technology brief Abstract...3 Introduction...3 Assessing facility requirements ...3 Using sizing tools to understand server and facility requirements 4 Data center assessment...5 Component power and cooling ...5 Processor power and cooling ...5 Processor P-state...5 P-state management ...6 Efficient practices for servers and enclosures 6 Understanding server power utilization and heat generation 6 Greater density with multi-core processors 7 Blade enclosures with integrated cooling hardware 7 Onboard thermal sensors and temperature management 7 Pooled power ...7 High-line power efficiency ...7 Power management and reporting of individual servers 8 Server virtualization using virtual machine technology 9 Efficient practices at the rack level...9 Rack configuration tools ...9 Methods for calculating power supply requirements 10 Power protection and management 10 Rack based power distribution ...10 High-efficiency power supplies...10 Understanding Internal airflow ...10 Liquid cooled racks...11 Efficient practices for facility-level power and cooling 12 Power management and reporting 13 Comprehensive management applications 13 Power Capping...13 Airflow distribution for high-density data centers 13 Raised floors ...15 Air supply plenum ...15 Ceiling return air plenum...17 Dual supply air plenums ...17 Perforated tiles ...17 Rack geometry ...18 Cooling footprint ...18 Hot and cold aisle spacing ...18 Row configuration ...18

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Optimizing facility operation in high density
data center environments
technology brief
Abstract
..............................................................................................................................................
3
Introduction
.........................................................................................................................................
3
Assessing facility requirements
..............................................................................................................
3
Using sizing tools to understand server and facility requirements
...........................................................
4
Data center assessment
.....................................................................................................................
5
Component power and cooling
.............................................................................................................
5
Processor power and cooling
............................................................................................................
5
Processor P-state
...........................................................................................................................
5
P-state management
......................................................................................................................
6
Efficient practices for servers and enclosures
.......................................................................................
6
Understanding server power utilization and heat generation
..............................................................
6
Greater density with multi-core processors
.......................................................................................
7
Blade enclosures with integrated cooling hardware
..........................................................................
7
Onboard thermal sensors and temperature management
...................................................................
7
Pooled power
..............................................................................................................................
7
High-line power efficiency
.............................................................................................................
7
Power management and reporting of individual servers
....................................................................
8
Server virtualization using virtual machine technology
.......................................................................
9
Efficient practices at the rack level
......................................................................................................
9
Rack configuration tools
................................................................................................................
9
Methods for calculating power supply requirements
........................................................................
10
Power protection and management
..............................................................................................
10
Rack based power distribution
.....................................................................................................
10
High-efficiency power supplies
.....................................................................................................
10
Understanding Internal airflow
.....................................................................................................
10
Liquid cooled racks
.....................................................................................................................
11
Efficient practices for facility-level power and cooling
.............................................................................
12
Power management and reporting
...................................................................................................
13
Comprehensive management applications
.....................................................................................
13
Power Capping
..........................................................................................................................
13
Airflow distribution for high-density data centers
................................................................................
13
Raised floors
..............................................................................................................................
15
Air supply plenum
......................................................................................................................
15
Ceiling return air plenum
.............................................................................................................
17
Dual supply air plenums
..............................................................................................................
17
Perforated tiles
...........................................................................................................................
17
Rack geometry
...........................................................................................................................
18
Cooling footprint
........................................................................................................................
18
Hot and cold aisle spacing
..........................................................................................................
18
Row configuration
......................................................................................................................
18