HP ML150 Optimizing facility operation in high density data center environment - Page 26

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Page 26 highlights

For more information For additional information, refer to the resources detailed below. Resource description Web address Thermal Considerations in Cooling Large Scale High Compute Density Data Centers white paper www.hpl.hp.com/research/papers/2002/thermal_may02.p df HP Rack/Site Installation Preparation Utility http://h30099.www3.hp.com/configurator/calc/Site%20Pr eparation%20Utility.xls Power calculators http://h30099.www3.hp.com/configurator/calc/Power%20 Calculator%20Catalog.xls C7000 Blade enclosure http://h20000.www2.hp.com/bc/docs/support/SupportMa nual/c00816246/c00816246.pdf Cable management for rack-mounted systems http://h20000.www2.hp.com/bc/docs/support/SupportMa nual/c01085208/c01085208.pdf HP Modular Cooling System Critical factors in intra-rack power distribution planning for high-density systems http://h20000.www2.hp.com/bc/docs/support/SupportMa nual/c00600082/c00600082.pdf http://h20000.www2.hp.com/bc/docs/support/SupportMa nual/c01034757/c01034757.pdf Server virtualization technologies for x86based HP BladeSystem and HP ProLiant servers http://h20000.www2.hp.com/bc/docs/support/SupportMa nual/c01067846/c01067846.pdf Data Center Cooling Strategies http://h20000.www2.hp.com/bc/docs/support/SupportMa nual/c01153741/c01153741.pdf Call to action Send comments about this paper to [email protected]. © 2007 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice. The only warranties for HP products and services are set forth in the express warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty. HP shall not be liable for technical or editorial errors or omissions contained herein. Microsoft and Windows are U.S. registered trademarks of Microsoft Corporation. Intel and Xeon are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries. TC070802TB, August 2007

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For more information
For additional information, refer to the resources detailed below.
Resource description
Web address
Thermal Considerations in Cooling Large
Scale High Compute Density Data Centers
white paper
www.hpl.hp.com/research/papers/2002/thermal_may02.p
df
HP Rack/Site Installation Preparation Utility
eparation%20Utility.xls
Power calculators
Calculator%20Catalog.xls
C7000 Blade enclosure
nual/c00816246/c00816246.pdf
Cable management for rack-mounted
systems
nual/c01085208/c01085208.pdf
HP Modular Cooling System
nual/c00600082/c00600082.pdf
Critical factors in intra-rack power
distribution planning for high-density
systems
nual/c01034757/c01034757.pdf
Server virtualization technologies for x86-
based HP BladeSystem and HP ProLiant
servers
nual/c01067846/c01067846.pdf
Data Center Cooling Strategies
nual/c01153741/c01153741.pdf
Call to action
Send comments about this paper to
.
© 2007 Hewlett-Packard Development Company, L.P. The information
contained herein is subject to change without notice. The only warranties for
HP products and services are set forth in the express warranty statements
accompanying such products and services. Nothing herein should be construed
as constituting an additional warranty. HP shall not be liable for technical or
editorial errors or omissions contained herein.
Microsoft and Windows are U.S. registered trademarks of Microsoft
Corporation.
Intel and Xeon are trademarks or registered trademarks of Intel Corporation or
its subsidiaries in the United States and other countries.
TC070802TB, August 2007