HP ML150 Optimizing facility operation in high density data center environment - Page 7

Greater density with multi-core processors, Blade enclosures with integrated cooling hardware - proliant g4

Page 7 highlights

Greater density with multi-core processors Multi-core processors take advantage of a fundamental relationship between power and frequency. Each core in a multi-core processor can run at a lower frequency, dividing among them the power normally given to a single core. The result is a performance increase over a single-core processor. Blade enclosures with integrated cooling hardware HP BladeSystem c-Class provides efficient cooling with the use of innovative Active Cool fan technology plus the intelligent management of the Onboard Administrator controller. HP Active Cool Fan technology optimizes airflow and reduces power draw for BladeSystem c-Class server blade configurations. The fans are controlled by the HP BladeSystem c-Class Onboard Administrator, which can increase or decrease cooling capacity based on the needs of the entire system. As a result, c-Class enclosures can accommodate full-featured servers that are 60 percent more dense than traditional rack-mount servers, while the Active Cool fans consume only 50 percent of the power typically required by fans and use 30 percent less airflow. Onboard thermal sensors and temperature management The inclusion of sensors within enclosures and racks, on servers and blades, and on any critical switch provides the capability to monitor changes and violations of operating thresholds. Management applications, such as HP Onboard Administrator, use that information to control server cooling and performance. Pooled power 'Pooled power' improves power usage by using only the power supplies needed to match the requirements of customers' consolidated infrastructures. Since power supplies are most efficient running at higher loads, this feature keeps them working at their most efficient levels while the power supply remains fully redundant. The HP Dynamic Power Saver is a feature of the BladeSystem c-Class and p-Class blade enclosures. The HP Dynamic Power Saver runs continuously in the background, pooling power distribution to maintain system performance at higher application loads and providing power savings at lower application loads. More information on 'Pooled Power' can be found at http://h20000.www2.hp.com/bc/docs/support/SupportManual/c00816246/c00816246.pdf. High-line power efficiency In the Americas and other areas that follow the same commercial wiring practices, organizations have the choice between low-line power (100-120V AC) and high-line power (200-240V AC) for their servers. This is an important choice, since high-line service is the most stable, efficient, and flexible AC power for server and data operations. High-line power offers greater efficiencies than single-phase power. Measuring the power consumption of a ProLiant DL380 G4 server demonstrates the higher efficiencies of high-line power. A test using the same system configuration, running a typical application, but using different AC supply voltages returned the power consumption data in Figure 3. 7

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Greater density with multi-core processors
Multi-core processors take advantage of a fundamental relationship between power and frequency.
Each core in a multi-core processor can run at a lower frequency, dividing among them the power
normally given to a single core. The result is a performance increase over a single-core processor.
Blade enclosures with integrated cooling hardware
HP BladeSystem c-Class provides efficient cooling with the use of innovative Active Cool fan
technology plus the intelligent management of the Onboard Administrator controller. HP Active Cool
Fan technology optimizes airflow and reduces power draw for BladeSystem c-Class server blade
configurations. The fans are controlled by the HP BladeSystem c-Class Onboard Administrator, which
can increase or decrease cooling capacity based on the needs of the entire system. As a result,
c-Class enclosures can accommodate full-featured servers that are 60 percent more dense than
traditional rack-mount servers, while the Active Cool fans consume only 50 percent of the power
typically required by fans and use 30 percent less airflow.
Onboard thermal sensors and temperature management
The inclusion of sensors within enclosures and racks, on servers and blades, and on any critical
switch provides the capability to monitor changes and violations of operating thresholds.
Management applications, such as HP Onboard Administrator, use that information to control server
cooling and performance.
Pooled power
‘Pooled power’ improves power usage by using only the power supplies needed to match the
requirements of customers’ consolidated infrastructures. Since power supplies are most efficient
running at higher loads, this feature keeps them working at their most efficient levels while the power
supply remains fully redundant. The HP Dynamic Power Saver is a feature of the BladeSystem c-Class
and p-Class blade enclosures. The HP Dynamic Power Saver runs continuously in the background,
pooling power distribution to maintain system performance at higher application loads and providing
power savings at lower application loads. More information on ‘Pooled Power’ can be found at
.
High-line power efficiency
In the Americas and other areas that follow the same commercial wiring practices, organizations
have the choice between low-line power (100-120V AC) and high-line power (200-240V AC) for
their servers. This is an important choice, since high-line service is the most stable, efficient, and
flexible AC power for server and data operations. High-line power offers greater efficiencies than
single-phase power.
Measuring the power consumption of a ProLiant DL380 G4 server demonstrates the higher efficiencies
of high-line power. A test using the same system configuration, running a typical application, but
using different AC supply voltages returned the power consumption data in Figure 3.
7