HP ML150 Optimizing facility operation in high density data center environment - Page 3

Abstract, Introduction, Assessing facility requirements, and data center level approaches. - g5 server

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Abstract This paper describes issues of high processor and server density within existing data center infrastructures. It identifies methods to optimize the effectiveness of power and cooling resources in facilities that are deploying high-density equipment or that are already fully populated with highdensity equipment. The intended audience for this paper includes IT managers, IT administrators, facility planners, and operations staff. Managers considering strategic planning activity such as facility upgrades or new facility planning should consult the "Data Center Cooling Strategies" technical brief available at http://h20000.www2.hp.com/bc/docs/support/SupportManual/c01153741/c01153741.pdf. Introduction Existing data centers have had three major operational and fiscal constraints - power, cooling and space. As existing data centers are required to support increasingly dense configurations, power and cooling requirements can outstrip the capabilities of the data center infrastructures. In fact, the issue of space becomes moot because existing data centers are projected to run out of power before they run out of space. HP understands that individual data center challenges like rack and processor level power and cooling cannot be viewed and managed as disconnected issues. HP has developed solutions to the fundamental issues of power and cooling at the processor, server, rack, and facility infrastructure level. HP also has developed proven management tools to provide a unified approach to managing power and cooling in data centers. This document describes issues, tools, and solutions for optimizing power and cooling at each level of the data center: processor, server, rack, and facility. The first section of this paper describes facility assessment and how the component and server level issues affect power and cooling, while the last half of the paper describes rack-level, facility layout, and data center level approaches. Assessing facility requirements Data center facilities face unprecedented power and cooling requirements. For example, 2 meter rack with 42 DL360 G5 servers can theoretically use up to 29 kVA of power at peak conditions; while a 2 meter rack with 64 HP BladeSystem c-Class server blades can use up to 31 kVA at peak conditions. A power draw of 30kVA per rack occupying 30 cu. ft. of space equals a power density of 1000 watts per square foot. However, a typical existing datacenter was built with redundant power of 3328 VA (20A singlephase) to 8640 VA (30A three-phase) and has a power/cooling density of 50 to 150 watts per square foot. As a result, capacity can be an order of magnitude too small. Server power densities have increased up to 10 times in the last 10 years, and industry trends suggest the power density projections displayed in Figure 1. 3

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Abstract
This paper describes issues of high processor and server density within existing data center
infrastructures. It identifies methods to optimize the effectiveness of power and cooling resources in
facilities that are deploying high-density equipment or that are already fully populated with high-
density equipment. The intended audience for this paper includes IT managers, IT administrators,
facility planners, and operations staff. Managers considering strategic planning activity such as
facility upgrades or new facility planning should consult the ”Data Center Cooling Strategies”
technical brief available at
.
Introduction
Existing data centers have had three major operational and fiscal constraints – power, cooling and
space. As existing data centers are required to support increasingly dense configurations, power and
cooling requirements can outstrip the capabilities of the data center infrastructures. In fact, the issue of
space becomes moot because existing data centers are projected to run out of power before they run
out of space.
HP understands that individual data center challenges like rack and processor level power and
cooling cannot be viewed and managed as disconnected issues. HP has developed solutions to the
fundamental issues of power and cooling at the processor, server, rack, and facility infrastructure
level. HP also has developed proven management tools to provide a unified approach to managing
power and cooling in data centers. This document describes issues, tools, and solutions for optimizing
power and cooling at each level of the data center: processor, server, rack, and facility.
The first section of this paper describes facility assessment and how the component and server level
issues affect power and cooling, while the last half of the paper describes rack-level, facility layout,
and data center level approaches.
Assessing facility requirements
Data center facilities face unprecedented power and cooling requirements. For example, 2 meter rack
with 42 DL360 G5 servers can theoretically use up to 29 kVA of power at peak conditions; while a 2
meter rack with 64 HP BladeSystem c-Class server blades can use up to 31 kVA at peak conditions. A
power draw of 30kVA per rack occupying 30 cu. ft. of space equals a power density of 1000 watts
per square foot.
However, a typical existing datacenter was built with redundant power of 3328 VA (20A single-
phase) to 8640 VA (30A three-phase) and has a power/cooling density of 50 to 150 watts per
square foot. As a result, capacity can be an order of magnitude too small.
Server power densities have increased up to 10 times in the last 10 years, and industry trends suggest
the power density projections displayed in Figure 1.
3