HP Pavilion g4-2300 HP Pavilion g4 Notebook PC Maintenance and Service Guide - Page 90
and the heat sink included with the base enclosure, heat sink, processor
View all HP Pavilion g4-2300 manuals
Add to My Manuals
Save this manual to your list of manuals |
Page 90 highlights
3. Loosen the four captive screws (2) and the three captive screws (3) that secure the heat sink to the system board. NOTE: Due to the adhesive quality of the thermal material located between the heat sink and system board components, it may be necessary to move the heat sink from side to side to detach it. 4. Remove the fan and heat sink (4). NOTE: The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the system board components each time the heat sink is removed. Replacement thermal material is included with the base enclosure, heat sink, processor, and system board spare part kits. ● Thermal paste is used on the processor (1) and the heat sink section (2) that services it ● A thermal pad is used on the graphics subsystem chip (3) and the heat sink section (4) that services it (only on computer models equipped with a graphics subsystem with switchable discrete memory) 82 Chapter 4 Removal and replacement procedures ENWW