HP Pavilion g4-2300 HP Pavilion g4 Notebook PC Maintenance and Service Guide - Page 93

the system board components each time the heat sink is removed. Replacement thermal material is

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2. Remove the PCH heat sink by lifting straight up (2). NOTE: Due to the adhesive quality of the thermal material located between the heat sink and system board components, it may be necessary to move the heat sink from side to side to detach it. NOTE: The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the system board components each time the heat sink is removed. Replacement thermal material is included with the base enclosure, heat sink, processor, and system board spare part kits. Reverse this procedure to install the PCH heat sink. ENWW Component replacement procedures 85

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2.
Remove the PCH heat sink by lifting straight up
(2)
.
NOTE:
Due to the adhesive quality of the thermal material located between the heat sink and
system board components, it may be necessary to move the heat sink from side to side to
detach it.
NOTE:
The thermal material must be thoroughly cleaned from the surfaces of the heat sink and
the system board components each time the heat sink is removed. Replacement thermal material is
included with the base enclosure, heat sink, processor, and system board spare part kits.
Reverse this procedure to install the PCH heat sink.
ENWW
Component replacement procedures
85