HP Pavilion g6-2300 HP Pavilion g6 Notebook PC Maintenance and Service Guide - Page 91
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2. Remove the PCH heat sink by lifting straight up (2). NOTE: Due to the adhesive quality of the thermal material located between the heat sink and system board components, it may be necessary to move the heat sink from side to side to detach it. NOTE: The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the system board components each time the heat sink is removed. Replacement thermal material is included with the base enclosure, heat sink, processor, and system board spare part kits. Reverse this procedure to install the PCH heat sink. Processor NOTE: The processor spare part kit includes replacement thermal material. Description AMD A10-4600M processor (3.2 GHz/2.3 GHz, 1600 MHz/4 MB L2 cache, DDR3, quad core, 35W) AMD A8-4500M processor (2.8 GHz/1.9 GHz, 1600 MHz/4 MB L2 cache, DDR3, quad core, 35W) AMD A6-4400M processor (3.2 GHz/2.7 GHz, 1600 MHz/1 MB L2 cache, DDR3, dual core, 35W) AMD A4-4300M processor (3.0 GHz/2.5 GHz, 1600 MHz/1 MB L2 cache, DDR3, dual core, 35W) Spare part number 683046-001 683048-001 683047-001 685990-001 ENWW Component replacement procedures 83