HP Presario CQ57-200 Compaq Presario CQ57 Notebook PC - Maintenance and Servic - Page 83

model equipped with an Intel Pentium processor and a graphics subsystem with discrete memory.

Get HP Presario CQ57-200 PDF manuals and user guides View all HP Presario CQ57-200 manuals
Add to My Manuals
Save this manual to your list of manuals

Page 83 highlights

The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the system board components each time the heat sink is removed. Replacement thermal material is included with the base enclosure, fan/heat sink assembly, processor, and system board spare part kits. Replacement thermal material is also available in the Thermal Material Kit, spare part number 646135-001. ● Thermal paste is used on the processor (1) and the heat sink section (2) that services it ● A thermal pad is used on the Northbridge chip (3) and the heat sink section (4) that services it NOTE: The following illustration shows the replacement thermal material locations on a computer model equipped with an Intel Pentium processor and a graphics subsystem with discrete memory. ● Thermal paste is used on the processor (1) and the heat sink section (2) that services it ● A thermal pad is used on the graphics subsystem chip (3) and the heat sink section (4) that services it NOTE: The following illustration shows the replacement thermal material locations on a computer model equipped with an Intel Pentium processor and a graphics subsystem with UMA memory. Component replacement procedures 75

  • 1
  • 2
  • 3
  • 4
  • 5
  • 6
  • 7
  • 8
  • 9
  • 10
  • 11
  • 12
  • 13
  • 14
  • 15
  • 16
  • 17
  • 18
  • 19
  • 20
  • 21
  • 22
  • 23
  • 24
  • 25
  • 26
  • 27
  • 28
  • 29
  • 30
  • 31
  • 32
  • 33
  • 34
  • 35
  • 36
  • 37
  • 38
  • 39
  • 40
  • 41
  • 42
  • 43
  • 44
  • 45
  • 46
  • 47
  • 48
  • 49
  • 50
  • 51
  • 52
  • 53
  • 54
  • 55
  • 56
  • 57
  • 58
  • 59
  • 60
  • 61
  • 62
  • 63
  • 64
  • 65
  • 66
  • 67
  • 68
  • 69
  • 70
  • 71
  • 72
  • 73
  • 74
  • 75
  • 76
  • 77
  • 78
  • 79
  • 80
  • 81
  • 82
  • 83
  • 84
  • 85
  • 86
  • 87
  • 88
  • 89
  • 90
  • 91
  • 92
  • 93
  • 94
  • 95
  • 96
  • 97
  • 98
  • 99
  • 100
  • 101
  • 102
  • 103
  • 104
  • 105
  • 106
  • 107
  • 108
  • 109
  • 110
  • 111
  • 112
The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the system
board components each time the heat sink is removed. Replacement thermal material is included with
the base enclosure, fan/heat sink assembly, processor, and system board spare part kits. Replacement
thermal material is also available in the Thermal Material Kit, spare part number 646135-001.
●
Thermal paste is used on the processor
(1)
and the heat sink section
(2)
that services it
●
A thermal pad is used on the Northbridge chip
(3)
and the heat sink section
(4)
that services it
NOTE:
The following illustration shows the replacement thermal material locations on a computer
model equipped with an Intel Pentium processor and a graphics subsystem with discrete memory.
●
Thermal paste is used on the processor
(1)
and the heat sink section
(2)
that services it
●
A thermal pad is used on the graphics subsystem chip
(3)
and the heat sink section
(4)
that
services it
NOTE:
The following illustration shows the replacement thermal material locations on a computer
model equipped with an Intel Pentium processor and a graphics subsystem with UMA memory.
Component replacement procedures
75