Intel BLKDG43NB Product Specification - Page 56

Thermal Considerations - warranty

Get Intel BLKDG43NB - MB 1333FSB DDR2 800 Aud+Lan SATA ATX PDF manuals and user guides
UPC - 735858201773
View all Intel BLKDG43NB manuals
Add to My Manuals
Save this manual to your list of manuals

Page 56 highlights

Intel Desktop Board DG43NB Technical Product Specification 2.5.2 Fan Header Current Capability CAUTION The processor fan must be connected to the processor fan header, not to a chassis fan header. Connecting the processor fan to a chassis fan header may result in onboard component damage that will halt fan operation. Table 30 lists the current capability of the fan headers. Table 30. Fan Header Current Capability Fan Header Maximum Available Current Processor fan Front chassis fan Rear chassis fan Auxiliary chassis fan 2.0 A 1.5 A 1.5 A 2.0 A 2.5.3 Add-in Board Considerations The board is designed to provide 2 A (average) of +5 V current for each add-in board. The total +5 V current draw for add-in boards for a fully loaded board (all three expansion slots filled and the PCI Express x16 connector filled) must not exceed 8 A. 2.6 Thermal Considerations CAUTION Failure to ensure appropriate airflow may result in reduced performance of both the processor and/or voltage regulator or, in some instances, damage to the board. For a list of chassis that have been tested with Intel desktop boards please refer to the following website: http://developer.intel.com/design/motherbd/cooling.htm All responsibility for determining the adequacy of any thermal or system design remains solely with the reader. Intel makes no warranties or representations that merely following the instructions presented in this document will result in a system with adequate thermal performance. CAUTION Ensure that the ambient temperature does not exceed the board's maximum operating temperature. Failure to do so could cause components to exceed their maximum case temperature and malfunction. For information about the maximum operating temperature, see the environmental specifications in Section 2.8. 56

  • 1
  • 2
  • 3
  • 4
  • 5
  • 6
  • 7
  • 8
  • 9
  • 10
  • 11
  • 12
  • 13
  • 14
  • 15
  • 16
  • 17
  • 18
  • 19
  • 20
  • 21
  • 22
  • 23
  • 24
  • 25
  • 26
  • 27
  • 28
  • 29
  • 30
  • 31
  • 32
  • 33
  • 34
  • 35
  • 36
  • 37
  • 38
  • 39
  • 40
  • 41
  • 42
  • 43
  • 44
  • 45
  • 46
  • 47
  • 48
  • 49
  • 50
  • 51
  • 52
  • 53
  • 54
  • 55
  • 56
  • 57
  • 58
  • 59
  • 60
  • 61
  • 62
  • 63
  • 64
  • 65
  • 66
  • 67
  • 68
  • 69
  • 70
  • 71
  • 72
  • 73
  • 74
  • 75
  • 76
  • 77
  • 78
  • 79
  • 80
  • 81
  • 82
  • 83
  • 84
  • 85
  • 86
  • 87
  • 88
Intel Desktop Board DG43NB Technical Product Specification
56
2.5.2
Fan Header Current Capability
CAUTION
The processor fan must be connected to the processor fan header, not to a chassis fan
header.
Connecting the processor fan to a chassis fan header may result in onboard
component damage that will halt fan operation.
Table 30 lists the current capability of the fan headers.
Table 30.
Fan Header Current Capability
Fan Header
Maximum Available Current
Processor fan
2.0 A
Front chassis fan
1.5 A
Rear chassis fan
1.5 A
Auxiliary chassis fan
2.0 A
2.5.3
Add-in Board Considerations
The board is designed to provide 2 A (average) of +5 V current for each add-in board.
The total +5 V current draw for add-in boards for a fully loaded board (all three
expansion slots filled and the PCI Express x16 connector filled) must not exceed 8 A.
2.6
Thermal Considerations
CAUTION
Failure to ensure appropriate airflow may result in reduced performance of both the
processor and/or voltage regulator or, in some instances, damage to the board.
For a
list of chassis that have been tested with Intel desktop boards please refer to the
following website:
All responsibility for determining the adequacy of any thermal or system design
remains solely with the reader.
Intel makes no warranties or representations that
merely following the instructions presented in this document will result in a system
with adequate thermal performance.
CAUTION
Ensure that the ambient temperature does not exceed the board’s maximum operating
temperature.
Failure to do so could cause components to exceed their maximum case
temperature and malfunction.
For information about the maximum operating
temperature, see the environmental specifications in Section 2.8.