Intel D2550DC2 Technical product specification - Page 27
Hardware Management Subsystem, 1.10.1 Hardware Monitoring
 |
View all Intel D2550DC2 manuals
Add to My Manuals
Save this manual to your list of manuals |
Page 27 highlights
Product Description 1.10 Hardware Management Subsystem The hardware management features enable the board to be compatible with the Wired for Management (WfM) specification. The board has several hardware management features, including the following: • Thermal monitoring • Voltage monitoring 1.10.1 Hardware Monitoring The hardware monitoring and fan control subsystem is based on the Winbond W83627DHG-P device, which supports the following: • System ambient temperature monitoring • System fan speed monitoring • Power monitoring of +12 V, +5 V, +5 Vstdby, +3.3 V, and +VCCP • SMBus interface 27
-
1 -
2
-
3
-
4
-
5
-
6
-
7
-
8
-
9
-
10
-
11
-
12
-
13
-
14
-
15
-
16
-
17
-
18
-
19
-
20
-
21
-
22 -
23 -
24 -
25 -
26 -
27 -
28 -
29 -
30 -
31 -
32 -
33
-
34
-
35
-
36
-
37
-
38
-
39
-
40
-
41
-
42
-
43
-
44
-
45
-
46
-
47
-
48
-
49
-
50
-
51
-
52
-
53
-
54
-
55
-
56
-
57
-
58
-
59
-
60
-
61
-
62
-
63
-
64
-
65
-
66
-
67
-
68
-
69
-
70
-
71
-
72
-
73
-
74
-
75
-
76
-
77
-
78
-
79
-
80
-
81
-
82
-
83
-
84
-
85
-
86
-
87
-
88
-
89
-
90
 |
 |
Product Description
27
1.10
Hardware Management Subsystem
The hardware management features enable the board to be compatible with the Wired
for Management (WfM) specification.
The board has several hardware management
features, including the following:
•
Thermal monitoring
•
Voltage monitoring
1.10.1
Hardware Monitoring
The hardware monitoring and fan control subsystem is based on the Winbond
W83627DHG-P device, which supports the following:
•
System ambient temperature monitoring
•
System fan speed monitoring
•
Power monitoring of +12 V, +5 V, +5 Vstdby, +3.3 V, and +VCCP
•
SMBus interface