Intel D2550DC2 Technical product specification - Page 7

Contents, Product Description, Technical Reference - drivers

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Contents 1 Product Description 1.1 Overview 11 1.1.1 Feature Summary 11 1.1.2 Board Layout 13 1.1.3 Block Diagram 15 1.2 Online Support 16 1.3 Processor 16 1.3.1 Intel® D2550 Graphics Subsystem 17 1.4 System Memory 18 1.5 Intel® NM10 Express Chipset 20 1.5.2 USB 21 1.5.3 SATA Support 21 1.6 Real-Time Clock Subsystem 22 1.7 Legacy I/O Controller 22 1.8 LAN Subsystem 23 1.8.1 LAN Subsystem Drivers 23 1.8.2 RJ-45 LAN Connector with Integrated LEDs 24 1.9 Audio Subsystem 25 1.9.1 Audio Subsystem Software 26 1.9.2 Audio Connectors and Headers 26 1.10 Hardware Management Subsystem 27 1.10.1 Hardware Monitoring 27 1.10.2 Thermal Monitoring 28 1.11 Power Management 29 1.11.1 ACPI 29 1.11.2 Hardware Support 32 2 Technical Reference 2.1 Memory Map 35 2.1.1 Addressable Memory 35 2.2 Connectors and Headers 38 2.2.1 Back Panel 39 2.2.2 Component-side Connectors and Headers 41 2.3 BIOS Configuration Jumper Block 50 2.4 Mechanical Considerations 52 2.4.1 Form Factor 52 2.5 Electrical Considerations 53 2.5.1 Fan Header Current Capability 53 2.5.2 Add-in Board Considerations 53 2.6 Thermal Considerations 53 2.6.1 Passive Heatsink Design in a Passive System Environment ......... 55 vii

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vii
Contents
1
Product Description
1.1
Overview
.........................................................................................
11
1.1.1
Feature Summary
.................................................................
11
1.1.2
Board Layout
........................................................................
13
1.1.3
Block Diagram
......................................................................
15
1.2
Online Support
.................................................................................
16
1.3
Processor
........................................................................................
16
1.3.1
Intel
®
D2550 Graphics Subsystem
...........................................
17
1.4
System Memory
...............................................................................
18
1.5
Intel
®
NM10 Express Chipset
..............................................................
20
1.5.2
USB
.....................................................................................
21
1.5.3
SATA Support
.......................................................................
21
1.6
Real-Time Clock Subsystem
...............................................................
22
1.7
Legacy I/O Controller
........................................................................
22
1.8
LAN Subsystem
................................................................................
23
1.8.1
LAN Subsystem Drivers
..........................................................
23
1.8.2
RJ-45 LAN Connector with Integrated LEDs
..............................
24
1.9
Audio Subsystem
..............................................................................
25
1.9.1
Audio Subsystem Software
.....................................................
26
1.9.2
Audio Connectors and Headers
................................................
26
1.10
Hardware Management Subsystem
.....................................................
27
1.10.1
Hardware Monitoring
.............................................................
27
1.10.2
Thermal Monitoring
...............................................................
28
1.11
Power Management
..........................................................................
29
1.11.1
ACPI
....................................................................................
29
1.11.2
Hardware Support
.................................................................
32
2
Technical Reference
2.1
Memory Map
....................................................................................
35
2.1.1
Addressable Memory
.............................................................
35
2.2
Connectors and Headers
....................................................................
38
2.2.1
Back Panel
...........................................................................
39
2.2.2
Component-side Connectors and Headers
.................................
41
2.3
BIOS Configuration Jumper Block
.......................................................
50
2.4
Mechanical Considerations
.................................................................
52
2.4.1
Form Factor
..........................................................................
52
2.5
Electrical Considerations
....................................................................
53
2.5.1
Fan Header Current Capability
................................................
53
2.5.2
Add-in Board Considerations
...................................................
53
2.6
Thermal Considerations
.....................................................................
53
2.6.1
Passive Heatsink Design in a Passive System Environment
.........
55