Intel D510MO Product Specification - Page 16

Online Support, 1.3 Processor, Intel Desktop Board D510MO Technical Product Specification - bios update

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Intel Desktop Board D510MO Technical Product Specification 1.2 Online Support To find information about... Intel Desktop Board D510MO Desktop Board Support Available configurations for the Intel Desktop Board D510MO Chipset information BIOS and driver updates Integration information Tested memory Visit this World Wide Web site: http://www.intel.com/products/motherboard/510MO/index.htm http://www.intel.com/support/motherboards/desktop http://www.intel.com/products/motherboard/D510MO/index.htm http://www.intel.com/products/desktop/chipsets/index.htm http://downloadcenter.intel.com http://www.intel.com/support/go/buildit http://www.intel.com/support/motherboards/desktop/sb/CS025414.htm 1.3 Processor The board has a passively-cooled, soldered-down Dual-Core Intel Atom processor with integrated graphics and integrated memory controller. NOTE The board is designed to be passively cooled in a properly ventilated chassis. Chassis venting locations are recommended above the processor heatsink area for maximum heat dissipation effectiveness. For information about Power supply connectors Refer to Section 2.2.2.3, page 50 16

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Intel Desktop Board D510MO Technical Product Specification
16
1.2
Online Support
To find information about…
Visit this World Wide Web site:
Intel Desktop Board D510MO
Desktop Board Support
Available configurations for the Intel
Desktop Board D510MO
Chipset information
BIOS and driver updates
Integration information
Tested memory
025414.htm
1.3
Processor
The board has a passively-cooled, soldered-down Dual-Core Intel Atom processor with
integrated graphics and integrated memory controller.
NOTE
The board is designed to be passively cooled in a properly ventilated chassis.
Chassis
venting locations are recommended above the processor heatsink area for maximum
heat dissipation effectiveness.
For information about
Refer to
Power supply connectors
Section 2.2.2.3, page 50