vii
Contents
1
Product Description
1.1
Overview
........................................................................................
11
1.1.1
Feature Summary
................................................................
11
1.1.2
Board Layout
.......................................................................
13
1.1.3
Block Diagram
.....................................................................
15
1.2
Online Support
................................................................................
16
1.3
Processor
.......................................................................................
16
1.3.1
Intel D510 Graphics Subsystem
..............................................
17
1.4
System Memory
..............................................................................
18
1.5
Intel
®
NM10 Express Chipset
.............................................................
19
1.5.2
USB
...................................................................................
21
1.5.3
SATA Support
......................................................................
21
1.6
Real-Time Clock Subsystem
..............................................................
22
1.7
Legacy I/O Controller
.......................................................................
22
1.7.1
Serial Port Headers
...............................................................
22
1.7.2
Parallel Port Header
..............................................................
23
1.8
LAN Subsystem
...............................................................................
23
1.8.1
LAN Subsystem Drivers
.........................................................
23
1.8.2
RJ-45 LAN Connector with Integrated LEDs
..............................
24
1.9
Audio Subsystem
.............................................................................
25
1.9.1
Audio Subsystem Software
....................................................
26
1.9.2
Audio Connectors and Headers
...............................................
26
1.10
Hardware Management Subsystem
....................................................
27
1.10.1
Hardware Monitoring
.............................................................
27
1.10.2
Thermal Monitoring
..............................................................
28
1.11
Power Management
.........................................................................
29
1.11.1
ACPI
...................................................................................
29
1.11.2
Hardware Support
................................................................
32
1.11.3
ENERGY STAR*, E-Standby, and EuP Compliance
......................
35
2
Technical Reference
2.1
Memory Map
...................................................................................
37
2.1.1
Addressable Memory
.............................................................
37
2.2
Connectors and Headers
...................................................................
40
2.2.1
Back Panel
..........................................................................
41
2.2.2
Component-side Connectors and Headers
................................
43
2.3
BIOS Configuration Jumper Block
.......................................................
54
2.4
Mechanical Considerations
................................................................
56
2.4.1
Form Factor
.........................................................................
56
2.5
Electrical Considerations
...................................................................
57
2.5.1
Fan Header Current Capability
................................................
57
2.5.2
Add-in Board Considerations
..................................................
57