Intel DG965MQ DG965MQ Technical Product Specification - Page 69
Reliability
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Technical Reference Table 36 provides maximum case temperatures for the board components that are sensitive to thermal changes. The operating temperature, current load, or operating frequency could affect case temperatures. Maximum case temperatures are important when considering proper airflow to cool the board. Table 36. Thermal Considerations for Components Component Maximum Case Temperature Processor For processor case temperature, see processor datasheets and processor specification updates Intel 82G965 GMCH Intel 82801HR/HH ICH8R/ICH8DH 97 oC (under bias) 105 oC (under bias) For information about Processor datasheets and specification updates Refer to Section 1.2, page 15 2.12 Reliability The Mean Time Between Failures (MTBF) prediction is calculated using component and subassembly random failure rates. The calculation is based on the Bellcore Reliability Prediction Procedure, TR-NWT-000332, Issue 4, September 1991. The MTBF prediction is used to estimate repair rates and spare parts requirements. The MTBF data is calculated from predicted data at 55 ºC. The Desktop Board DG965MQ MTBF is 105,367 hours. 69