Intel DG965MQ DG965MQ Technical Product Specification - Page 7

Regulatory Compliance and Battery Disposal Information, s, Tables - i o shield

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Contents 5 Regulatory Compliance and Battery Disposal Information 5.1 Regulatory Compliance 85 5.1.1 Safety Regulations 85 5.1.2 European Union Declaration of Conformity Statement 86 5.1.3 Product Ecology Statements 88 5.1.4 EMC Regulations 92 5.1.5 Product Certification Markings (Board Level 93 5.2 Battery Disposal Information 94 Figures 1. Major Board Components 12 2. Block Diagram 14 3. Memory Channel Configuration and DIMM Configuration 18 4. Dual Channel (Interleaved) Mode Configuration with Two DIMMs 19 5. Dual Channel (Interleaved) Mode Configuration with Three DIMMs ......... 19 6. Dual Channel (Interleaved) Mode Configuration with Four DIMMs 20 7. Single Channel (Asymmetric) Mode Configuration with One DIMM .......... 21 8. Single Channel (Asymmetric) Mode Configuration with Three DIMMs....... 21 9. Flex Mode Configuration with Two DIMMs 22 10. Front/Back Panel Audio Connector Options 31 11. LAN Connector LED Locations 33 12. Thermal Sensors and Fan Headers 35 13. Location of the Standby Power Indicator LED 42 14. Detailed System Memory Address Map 44 15. Back Panel Connectors 51 16. Component-side Connectors and Headers 52 17. Connection Diagram for Front Panel Header 58 18. Connection Diagram for Front Panel USB Headers 60 19. Connection Diagram for IEEE 1394a Header 60 20. Location of the Jumper Block 61 21. Board Dimensions 62 22. I/O Shield Dimensions for Boards with PS/2 Connectors 63 23. I/O Shield Dimensions for Boards without PS/2 Connectors 64 24. Localized High Temperature Zones 68 Tables 1. Feature Summary 10 2. Manufacturing Options 11 3. Board Components Shown in Figure 1 13 4. Supported Memory Configurations 16 5. Memory Operating Frequencies 17 6. DVI Port Status Conditions 25 7. Audio Jack Retasking Support 30 8. LAN Connector LED States 33 9. Effects of Pressing the Power Switch 36 vii

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Contents
vii
5
Regulatory Compliance and Battery Disposal Information
5.1
Regulatory Compliance
.....................................................................
85
5.1.1
Safety Regulations
................................................................
85
5.1.2
European Union Declaration of Conformity Statement
................
86
5.1.3
Product Ecology Statements
...................................................
88
5.1.4
EMC Regulations
..................................................................
92
5.1.5
Product Certification Markings (Board Level)
.............................
93
5.2
Battery Disposal Information
.............................................................
94
Figures
1.
Major Board Components
..................................................................
12
2.
Block Diagram
................................................................................
14
3.
Memory Channel Configuration and DIMM Configuration
........................
18
4.
Dual Channel (Interleaved) Mode Configuration with Two DIMMs
............
19
5.
Dual Channel (Interleaved) Mode Configuration with Three DIMMs
.........
19
6.
Dual Channel (Interleaved) Mode Configuration with Four DIMMs
...........
20
7.
Single Channel (Asymmetric) Mode Configuration with One DIMM
..........
21
8.
Single Channel (Asymmetric) Mode Configuration with Three DIMMs
.......
21
9.
Flex Mode Configuration with Two DIMMs
............................................
22
10. Front/Back Panel Audio Connector Options
..........................................
31
11. LAN Connector LED Locations
............................................................
33
12. Thermal Sensors and Fan Headers
.....................................................
35
13. Location of the Standby Power Indicator LED
.......................................
42
14. Detailed System Memory Address Map
...............................................
44
15. Back Panel Connectors
.....................................................................
51
16. Component-side Connectors and Headers
...........................................
52
17. Connection Diagram for Front Panel Header
........................................
58
18. Connection Diagram for Front Panel USB Headers
................................
60
19. Connection Diagram for IEEE 1394a Header
........................................
60
20. Location of the Jumper Block
.............................................................
61
21. Board Dimensions
...........................................................................
62
22. I/O Shield Dimensions for Boards with PS/2 Connectors
........................
63
23. I/O Shield Dimensions for Boards without PS/2 Connectors
...................
64
24. Localized High Temperature Zones
.....................................................
68
Tables
1.
Feature Summary
............................................................................
10
2.
Manufacturing Options
.....................................................................
11
3.
Board Components Shown in Figure 1
................................................
13
4.
Supported Memory Configurations
.....................................................
16
5.
Memory Operating Frequencies
.........................................................
17
6.
DVI Port Status Conditions
................................................................
25
7.
Audio Jack Retasking Support
...........................................................
30
8.
LAN Connector LED States
................................................................
33
9.
Effects of Pressing the Power Switch
..................................................
36