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Intel DG965MQ DG965MQ Technical Product Specification - Page 70

Environmental

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Intel Desktop Board DG965MQ Technical Product Specification 2.13 Environmental Table 37 lists the environmental specifications for the board. Table 37. Desktop Board DG965MQ Environmental Specifications Parameter Specification Temperature Non-Operating Operating -40 °C to +70 °C 0 °C to +55 °C Shock Unpackaged 50 g trapezoidal waveform Velocity change of 170 inches/second² Packaged Half sine 2 millisecond Product weight (pounds) Free fall (inches) Velocity change (inches/sec²)

Section	Page
Intel® Desktop Board DG965MQ Technical Product Specification	1
Revision History / Disclaimer	2
Preface	3
Intended Audience	3
What This Document Contains	3
Typographical Conventions	3
Contents	5
1 Product Description	9
1.1 Overview	10
1.1.1 Feature Summary	10
1.1.2 Manufacturing Options	11
1.1.3 Board Layout	12
1.1.4 Block Diagram	14
1.2 Online Support	15
1.3 Processor	15
1.4 System Memory	16
1.4.1 Memory Configurations	18
1.5 Intel® G965 Express Chipset	23
1.5.1 Intel G965 Graphics Subsystem	23
1.5.2 USB	26
1.5.3 Serial ATA Interfaces	27
1.5.4 Parallel IDE Interface	28
1.5.5 Real-Time Clock, CMOS SRAM, and Battery	28
1.6 Legacy I/O Controller	29
1.6.1 Serial Port Interface	29
1.6.2 Parallel Port Interface	29
1.6.3 Diskette Drive Interface	29
1.6.4 PS/2 Keyboard and Mouse Interface (Optional)	29
1.7 Audio Subsystem	30
1.7.1 Audio Subsystem Software	30
1.7.2 Audio Connectors and Headers	31
1.8 LAN Subsystem	32
1.8.1 Intel® 82566DC Gigabit Ethernet Controller	32
1.8.2 LAN Subsystem Software	33
1.8.3 RJ-45 LAN Connector with Integrated LEDs	33
1.9 Hardware Management Subsystem	34
1.9.1 Hardware Monitoring and Fan Control	34
1.9.2 Fan Monitoring	34
1.9.3 Chassis Intrusion and Detection	34
1.9.4 Thermal Monitoring	35
1.10 Power Management	36
1.10.1 ACPI	36
1.10.2 Hardware Support	38
2 Technical Reference	43
2.1 Memory Map	43
2.1.1 Addressable Memory	43
2.2 DMA Channels	45
2.3 Fixed I/O Map	46
2.4 PCI Configuration Space Map	47
2.5 Interrupts	48
2.6 PCI Interrupt Routing Map	49
2.7 Connectors and Headers	50
2.7.1 Back Panel Connectors	51
2.7.2 Component-side Connectors and Headers	52
2.8 Jumper Block	61
2.9 Mechanical Considerations	62
2.9.1 Form Factor	62
2.9.2 I/O Shield	63
2.10 Electrical Considerations	65
2.10.1 DC Loading	65
2.10.2 Fan Header Current Capability	65
2.10.3 Add-in Board Considerations	66
2.10.4 Power Supply Considerations	66
2.11 Thermal Considerations	67
2.12 Reliability	69
2.13 Environmental	70
3 Overview of BIOS Features	71
3.1 Introduction	71
3.2 BIOS Flash Memory Organization	72
3.3 Resource Configuration	72
3.3.1 PCI Autoconfiguration	72
3.3.2 PCI IDE Support	73
3.4 System Management BIOS (SMBIOS)	73
3.5 Legacy USB Support	74
3.6 BIOS Updates	74
3.6.1 Language Support	75
3.6.2 Custom Splash Screen	75
3.7 BIOS Recovery	75
3.8 Boot Options	76
3.8.1 CD-ROM Boot	76
3.8.2 Network Boot	76
3.8.3 Booting Without Attached Devices	76
3.8.4 Changing the Default Boot Device During POST	76
3.9 Adjusting Boot Speed	77
3.9.1 Peripheral Selection and Configuration	77
3.9.2 BIOS Boot Optimizations	77
3.10 BIOS Security Features	78
4 Error Messages and Beep Codes	79
4.1 Speaker	79
4.2 BIOS Beep Codes	79
4.3 BIOS Error Messages	79
4.4 Port 80h POST Codes	80
5 Regulatory Compliance and Battery Disposal Information	85
5.1 Regulatory Compliance	85
5.1.1 Safety Regulations	85
5.1.2 European Union Declaration of Conformity Statement	86
5.1.3 Product Ecology Statements	88
5.1.4 EMC Regulations	92
5.1.5 Product Certification Markings (Board Level)	93