Intel DH61HO Technical Product Specification - Page 11

1 Product Description 1.1 Overview 1.1.1 Feature Summary Table 2 summarizes the major features of the board. Table 2. Feature Summary Form Factor Processor Chipset Memory Graphics Audio MicroATX (8.86 inches by 7.50 inches [225 millimeters by 190 millimeters]) • 3rd generation Intel® Core processor family and 2nd generation Intel® Core processor family processors with up to 65 W TDP in an LGA1155 socket ― PCI Express* 3.0 x16 graphics interface ― Integrated graphics processing (processors with Intel® Graphics Technology) ― External graphics interface controller ― Integrated memory controller with dual channel DDR3 memory support Intel® H61 Express Chipset consisting of the Intel® H61 Platform Controller Hub (PCH) • Two 240-pin DDR3 SDRAM Dual Inline Memory Module (DIMM) sockets • Support for DDR3 1333 MHz and DDR3 1066 MHz DIMMs • Support for 1 Gb, 2 Gb, and 4 Gb memory technology • Support for up to 16 GB of system memory with two DIMMs using 4 Gb memory technology • Support for non-ECC memory • Integrated graphics support for processors with Intel® Graphics Technology ― VGA • Support for PCI Express 3.0 x16 add-in graphics cards Note: PCI Express 3.0 is only supported by 3rd generation Intel Core processor family processors • Intel® High Definition Audio: ― Realtek* ALC662 audio codec ― Front panel audio header for Intel HD Audio and AC '97 Audio support continued 11