Intel DH61HO Technical Product Specification - Page 52

Localized High Temperature Zones, Table 25., Thermal Considerations for Components

Get Intel DH61HO PDF manuals and user guides View all Intel DH61HO manuals
Add to My Manuals
Save this manual to your list of manuals

Page 52 highlights

Intel Desktop Board DH61HO Technical Product Specification Figure 14 shows the locations of the localized high temperature zones. Item A B C Description Processor voltage regulator area Processor Intel H61 Express Chipset Figure 14. Localized High Temperature Zones Table 25 provides maximum case temperatures for the components that are sensitive to thermal changes. The operating temperature, current load, or operating frequency could affect case temperatures. Maximum case temperatures are important when considering proper airflow to cool the board. Table 25. Thermal Considerations for Components Component Maximum Case Temperature Processor For processor case temperature, see processor datasheets and processor specification updates Intel H61 Express Chipset 111 oC (under bias) For information about Processor datasheets and specification updates Refer to Section 1.2, page 16 52

  • 1
  • 2
  • 3
  • 4
  • 5
  • 6
  • 7
  • 8
  • 9
  • 10
  • 11
  • 12
  • 13
  • 14
  • 15
  • 16
  • 17
  • 18
  • 19
  • 20
  • 21
  • 22
  • 23
  • 24
  • 25
  • 26
  • 27
  • 28
  • 29
  • 30
  • 31
  • 32
  • 33
  • 34
  • 35
  • 36
  • 37
  • 38
  • 39
  • 40
  • 41
  • 42
  • 43
  • 44
  • 45
  • 46
  • 47
  • 48
  • 49
  • 50
  • 51
  • 52
  • 53
  • 54
  • 55
  • 56
  • 57
  • 58
  • 59
  • 60
  • 61
  • 62
  • 63
  • 64
  • 65
  • 66
  • 67
  • 68
  • 69
  • 70
  • 71
  • 72
  • 73
  • 74
  • 75
  • 76
  • 77
  • 78
  • 79
  • 80
  • 81
  • 82
Intel Desktop Board DH61HO Technical Product Specification
52
Figure 14 shows the locations of the localized high temperature zones.
Item
Description
A
Processor voltage regulator area
B
Processor
C
Intel H61 Express Chipset
Figure 14.
Localized High Temperature Zones
Table 25 provides maximum case temperatures for the components that are sensitive
to thermal changes.
The operating temperature, current load, or operating frequency
could affect case temperatures.
Maximum case temperatures are important when
considering proper airflow to cool the board.
Table 25.
Thermal Considerations for Components
Component
Maximum Case Temperature
Processor
For processor case temperature, see processor datasheets and
processor specification updates
Intel H61 Express Chipset
111
o
C (under bias)
For information about
Refer to
Processor datasheets and specification updates
Section 1.2, page 16