Intel DH61HO Technical Product Specification - Page 9

Regulatory Compliance and Battery Disposal Information, s, Tables - front panel

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Contents 5 Regulatory Compliance and Battery Disposal Information 5.1 Regulatory Compliance 69 5.1.1 Safety Standards 69 5.1.2 European Union Declaration of Conformity Statement 70 5.1.3 Product Ecology Statements 71 5.1.4 EMC Regulations 73 5.1.5 ENERGY STAR* 5.0, e-Standby, and ErP Compliance 76 5.1.6 Regulatory Compliance Marks (Board Level 77 5.2 Battery Disposal Information 78 Figures 1. Major Board Components 13 2. Block Diagram 15 3. Memory Channel and DIMM Configuration 19 4. Back Panel Audio Connector Options 22 5. LAN Connector LED Locations 24 6. Thermal Sensors and Fan Headers 26 7. Detailed System Memory Address Map 36 8. Back Panel Connectors 38 9. Component-side Connectors and Headers 39 10. Connection Diagram for Front Panel Header 44 11. Connection Diagram for the Front Panel USB Header 46 12. Location of the Jumper Block 47 13. Board Dimensions 48 14. Localized High Temperature Zones 52 Tables 1. Specification Changes or Clarifications iii 2. Feature Summary 11 3. Components Shown in Figure 1 14 4. Supported Memory Configurations 18 5. Audio Jack Support 21 6. LAN Connector LED States 24 7. Effects of Pressing the Power Switch 28 8. Power States and Targeted System Power 29 9. Wake-up Devices and Events 30 10. System Memory Map 37 11. Component-side Connectors and Headers Shown in Figure 9 40 12. Serial Port Header 41 13. Front Panel Audio Header for Intel HD Audio 41 14. Front Panel Audio Header for AC '97 Audio 41 15. Front Panel USB Header 41 16. SATA Connectors 42 17. Fan Headers 42 ix

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Contents
ix
5
Regulatory Compliance and Battery Disposal Information
5.1
Regulatory Compliance
......................................................................
69
5.1.1
Safety Standards
...................................................................
69
5.1.2
European Union Declaration of Conformity Statement
................
70
5.1.3
Product Ecology Statements
...................................................
71
5.1.4
EMC Regulations
...................................................................
73
5.1.5
ENERGY STAR* 5.0, e-Standby, and ErP Compliance
.................
76
5.1.6
Regulatory Compliance Marks (Board Level)
.............................
77
5.2
Battery Disposal Information
..............................................................
78
Figures
1.
Major Board Components
..................................................................
13
2.
Block Diagram
..................................................................................
15
3.
Memory Channel and DIMM Configuration
............................................
19
4.
Back Panel Audio Connector Options
...................................................
22
5.
LAN Connector LED Locations
.............................................................
24
6.
Thermal Sensors and Fan Headers
......................................................
26
7.
Detailed System Memory Address Map
................................................
36
8.
Back Panel Connectors
......................................................................
38
9.
Component-side Connectors and Headers
............................................
39
10. Connection Diagram for Front Panel Header
.........................................
44
11. Connection Diagram for the Front Panel USB Header
.............................
46
12. Location of the Jumper Block
.............................................................
47
13. Board Dimensions
.............................................................................
48
14. Localized High Temperature Zones
.....................................................
52
Tables
1.
Specification Changes or Clarifications
...................................................
iii
2.
Feature Summary
.............................................................................
11
3.
Components Shown in Figure 1
..........................................................
14
4.
Supported Memory Configurations
......................................................
18
5.
Audio Jack Support
...........................................................................
21
6.
LAN Connector LED States
.................................................................
24
7.
Effects of Pressing the Power Switch
...................................................
28
8.
Power States and Targeted System Power
...........................................
29
9.
Wake-up Devices and Events
.............................................................
30
10. System Memory Map
.........................................................................
37
11. Component-side Connectors and Headers Shown in Figure 9
..................
40
12. Serial Port Header
............................................................................
41
13. Front Panel Audio Header for Intel HD Audio
........................................
41
14. Front Panel Audio Header for AC ’97 Audio
...........................................
41
15. Front Panel USB Header
....................................................................
41
16. SATA Connectors
..............................................................................
42
17. Fan Headers
....................................................................................
42