Home » Intel Manuals » Motherboards » Intel DP55WB » Manual Viewer

Intel DP55WB Product Specification - Page 56

Reliability, Environmental - parts

UPC - 735858209151

Add to My Manuals
Save this manual to your list of manuals

Page 56 highlights

Intel Desktop Board DP55WB Technical Product Specification 2.7 Reliability The Mean Time Between Failures (MTBF) prediction is calculated using component and subassembly random failure rates. The calculation is based on the Bellcore Reliability Prediction Procedure, TR-NWT-000332, Issue 4, September 1991. The MTBF prediction is used to estimate repair rates and spare parts requirements. The MTBF data is calculated from predicted data at 55 ºC. The MTBF for the board is 119,790 hours. 2.8 Environmental Table 27 lists the environmental specifications for the board. Table 27. Environmental Specifications Parameter Temperature Non-Operating Operating Shock Unpackaged Packaged Vibration Unpackaged Packaged Specification -20 °C to +70 °C 0 °C to +55 °C 50 g trapezoidal waveform Velocity change of 170 inches/second² Half sine 2 millisecond Product Weight (pounds) Free Fall (inches)

Section	Page
Intel® Desktop Board DP55WB Technical Product Specification	1
Revision History	2
Preface	3
Intended Audience	3
What This Document Contains	3
Typographical Conventions	3
Contents	5
1 Product Description	9
1.1 Overview	9
1.1.1 Feature Summary	9
1.1.2 Board Layout	11
1.1.3 Block Diagram	13
1.2 Legacy Considerations	13
1.3 Online Support	14
1.4 Processor	14
1.5 System Memory	15
1.5.1 Memory Configurations	16
1.6 Intel® P55 Express Chipset	18
1.6.1 USB	18
1.6.2 SATA Interfaces	19
1.7 Real-Time Clock Subsystem	20
1.8 Audio Subsystem	20
1.8.1 Audio Subsystem Software	21
1.8.2 Audio Connectors and Headers	21
1.8.3 6-Channel (5.1) Audio Subsystem	21
1.9 LAN Subsystem	22
1.9.1 Intel® 82578DC Gigabit Ethernet Controller	22
1.9.2 LAN Subsystem Software	23
1.9.3 RJ-45 LAN Connector with Integrated LEDs	23
1.10 Hardware Management Subsystem	24
1.10.1 Hardware Monitoring and Fan Control	24
1.10.2 Fan Monitoring	24
1.10.3 Chassis Intrusion and Detection	24
1.10.4 Thermal Monitoring	25
1.11 Power Management	26
1.11.1 ACPI	26
1.11.2 Hardware Support	28
1.11.3 ENERGY STAR*, E-Standby, and EuP Compliance	33
2 Technical Reference	35
2.1 Memory Resources	35
2.1.1 Addressable Memory	35
2.1.2 Memory Map	37
2.2 Connectors and Headers	37
2.2.1 Back Panel Connectors	38
2.2.2 Component-side Connectors and Headers	39
2.3 Jumper Block	49
2.4 Mechanical Considerations	51
2.4.1 Form Factor	51
2.5 Electrical Considerations	52
2.5.1 Power Supply Considerations	52
2.5.2 Fan Header Current Capability	53
2.5.3 Add-in Board Considerations	53
2.6 Thermal Considerations	53
2.7 Reliability	56
2.8 Environmental	56
3 Overview of BIOS Features	57
3.1 Introduction	57
3.2 BIOS Flash Memory Organization	58
3.3 Resource Configuration	58
3.3.1 PCI Autoconfiguration	58
3.4 System Management BIOS (SMBIOS)	59
3.5 Legacy USB Support	59
3.6 BIOS Updates	60
3.6.1 Language Support	60
3.6.2 Custom Splash Screen	61
3.7 BIOS Recovery	61
3.8 Boot Options	62
3.8.1 CD-ROM Boot	62
3.8.2 Network Boot	62
3.8.3 Booting Without Attached Devices	62
3.8.4 Changing the Default Boot Device During POST	62
3.9 Adjusting Boot Speed	63
3.9.1 Peripheral Selection and Configuration	63
3.9.2 BIOS Boot Optimizations	63
3.10 BIOS Security Features	64
3.11 BIOS Performance Features	65
4 Error Messages and Beep Codes	67
4.1 Speaker	67
4.2 BIOS Beep Codes	67
4.3 Front-panel Power LED Blink Codes	68
4.4 BIOS Error Messages	68
4.5 Port 80h POST Codes	69
5 Regulatory Compliance and Battery Disposal Information	75
5.1 Regulatory Compliance	75
5.1.1 Safety Standards	75
5.1.2 European Union Declaration of Conformity Statement	76
5.1.3 Product Ecology Statements	77
5.1.4 EMC Regulations	81
5.1.5 Product Certification Markings (Board Level)	82