Intel DP55WB Product Specification - Page 9

1 Product Description 1.1 Overview 1.1.1 Feature Summary Table 1 summarizes the major features of the board. Table 1. Feature Summary Form Factor MicroATX (9.60 inches by 9.60 inches [243.84 millimeters by 243.84 millimeters]) Processor Memory Chipset Audio Peripheral Interfaces BIOS Instantly Available PC Technology LAN Support • Intel® Core™ i7 and Core i5 processors in an LGA1156 socket ― One PCI Express* 2.0 x16 Graphics interface ― Integrated memory controller with dual channel DDR3 memory support • Four 240-pin DDR3 SDRAM Dual Inline Memory Module (DIMM) sockets • Support for DDR3 1333 MHz and DDR3 1066 MHz DIMMs • Support for 1 Gb and 2 Gb memory technology • Support for up to 16 GB of system memory with four DIMMs using 2 Gb memory technology • Support for non-ECC memory • Support for 1.35 V low voltage JEDEC memory Intel® P55 Express Chipset consisting of the Intel® P55 Express Platform Controller Hub (PCH) 5.1+2-channel audio subsystem using the Realtek* ALC888-VC2-GR audio codec • Fourteen USB 2.0 ports: ― Eight ports are implemented with stacked back panel connectors ― Six front panel ports implemented through three internal headers; one header supports an Intel® Z-U130 USB Solid-State Drive (or compatible device) • Six internal Serial ATA (SATA) 3.0 Gb/s interfaces through Intel P55 Express Chipset with Intel Matrix Storage Technology RAID support • Two IEEE 1394a ports: ― One port via a back panel connector ― One port via an internal header for front panel cabling • Intel® BIOS resident in the SPI Flash device • Support for Advanced Configuration and Power Interface (ACPI), Plug and Play, and SMBIOS • Support for PCI* Local Bus Specification Revision 2.2 • Support for PCI Express* Revision 2.0 • Suspend to RAM support • Wake on PCI, PCI Express, LAN, front panel, and USB ports Gigabit (10/100/1000 Mbits/s) LAN subsystem using the Intel® 82578DC Gigabit Ethernet Controller continued 9