Intel DQ57TM Product Specification - Page 9

1 Product Description 1.1 Overview 1.1.1 Feature Summary Table 1 summarizes the major features of the board. Table 1. Feature Summary Form Factor Processor Chipset Memory Graphics Audio Peripheral Interfaces Legacy I/O Control MicroATX (9.60 inches by 9.60 inches [243.84 millimeters by 243.84 millimeters]) • Intel® Core™ i7, Intel® Core™ i5, Intel® Core™ i3, Intel® Pentium® processors, and Intel® Xeon® processor 3400 series in an LGA1156 socket: ― Integrated graphics processing (processors with Intel® Graphics Technology) ― External graphics interface controller ― Integrated memory controller Intel® Q57 Express Chipset consisting of the Intel® Q57 Platform Controller Hub (PCH) • Four 240-pin DDR3 SDRAM Dual Inline Memory Module (DIMM) sockets • Support for DDR3 1333 MHz and DDR3 1066 MHz DIMMs • Support for 1 Gb and 2 Gb memory technology • Support for up to 16 GB of system memory with four DIMMs using 2 Gb memory technology • Support for non-ECC memory • Support for unbuffered ECC memory with Intel Xeon processor 3400 series • Integrated graphics support for processors with Intel® Graphics Technology: ― DVI-I ― DVI-D ― DisplayPort* • Discrete graphics support for PCI Express 2.0 x16 add-in graphics card • Intel® High Definition Audio: ― Realtek* ALC662 audio codec ― S/PDIF audio header ― DisplayPort Digital Audio • Fourteen USB 2.0 ports: ― Six ports are implemented with stacked back panel connectors ― Eight front panel ports are implemented through four dual-port internal headers • Six SATA interfaces through the Intel Q57 Express Chipset with Intel® Rapid Storage Technology RAID support: ― Four internal SATA 3.0 Gb/s ports ― One internal eSATA 3.0 Gb/s port ― One backpanel eSATA 3.0 Gb/s port • One serial port header • Nuvoton* W83677 Super I/O controller for hardware management and serial port support continued 9