Intel E6300 Data Sheet - Page 10

Introduction 1.1.1 "Front Side Bus" refers to the interface between the processor and system core logic (also known as, the chipset components). The FSB is a multiprocessing interface to processors, memory, and I/O. Processor Terminology Definitions Commonly used terms are explained here for clarification: • Intel® Pentium® dual-core processor E5000 series - Dual core processor in the FC-LGA8 package with a 2 MB L2 cache. • Intel® Pentium® dual-core processor E6000 series - Dual core processor in the FC-LGA8 package with a 2 MB L2 cache. • Processor - For this document, the term processor is the generic form of the Intel® Pentium® dual-core processor E5000 and E6000 series. • Voltage Regulator Design Guide - For this document "Voltage Regulator Design Guide" may be used in place of: - Voltage Regulator-Down (VRD) 11.0 Processor Power Delivery Design Guidelines For Desktop LGA775 Socket • Enhanced Intel® Core™ microarchitecture - A new foundation for Intel® architecture-based desktop, mobile, and mainstream server multi-core processors. For additional information see: http://www.intel.com/technology/architecture/ coremicro/ • Keep-out zone - The area on or near the processor that system design can not use. • Processor core - Processor die with integrated L2 cache. • LGA775 socket - The processors mate with the system board through a surface mount, 775-land, LGA socket. • Integrated heat spreader (IHS) -A component of the processor package used to enhance the thermal performance of the package. Component thermal solutions interface with the processor at the IHS surface. • Retention mechanism (RM) - Since the LGA775 socket does not include any mechanical features for heatsink attach, a retention mechanism is required. Component thermal solutions should attach to the processor using a retention mechanism that is independent of the socket. • FSB (Front Side Bus) - The electrical interface that connects the processor to the chipset. Also referred to as the processor system bus or the system bus. All memory and I/O transactions, as well as interrupt messages, pass between the processor and chipset over the FSB. • Storage conditions - Refers to a non-operational state. The processor may be installed in a platform, in a tray, or loose. Processors may be sealed in packaging or exposed to free air. Under these conditions, processor lands should not be connected to any supply voltages, have any I/Os biased, or receive any clocks. Upon exposure to "free air"(that is, unsealed packaging or a device removed from packaging material), the processor must be handled in accordance with moisture sensitivity labeling (MSL) as indicated on the packaging material. • Functional operation - Refers to normal operating conditions in which all processor specifications, including DC, AC, system bus, signal quality, mechanical and thermal are satisfied. • Execute Disable Bit - Execute Disable Bit allows memory to be marked as executable or non-executable, when combined with a supporting operating system. If code attempts to run in non-executable memory, the processor raises an error to the operating system. This feature can prevent some classes of viruses or worms that exploit buffer overrun vulnerabilities and can thus help improve the overall 10 Datasheet