Intel E6300 Data Sheet - Page 38

Package Mechanical Specifications 3.5 Package Insertion Specifications The processor can be inserted into and removed from a LGA775 socket 15 times. The socket should meet the LGA775 requirements detailed in the LGA775 Socket Mechanical Design Guide. 3.6 Processor Mass Specification The typical mass of the processor is 21.5 g [0.76 oz]. This mass [weight] includes all the components that are included in the package. 3.7 Table 22. Processor Materials Table 22 lists some of the package components and associated materials. Processor Materials Component Integrated Heat Spreader (IHS) Substrate Substrate Lands Material Nickel Plated Copper Fiber Reinforced Resin Gold Plated Copper 3.8 Figure 9. Processor Markings Figure 9 and Figure 10 show the top-side markings on the processor. These diagrams can be used to aid in the identification of the processor. Intel® Pentium® Dual-Core Processor E5000 Series Top-Side Markings Example INTEL ©M'06 E5200 Intel® Pentium® Dual-Core SLAY7 [COO] 2.50GHZ/2M/800/06 [FPO] e4 ATPO S/N 38 Datasheet