Intel E6300 Data Sheet - Page 76

Table 26., Processor Thermal Specifications - processor power consumption

Page 76 highlights

Thermal Specifications and Design Considerations The case temperature is defined at the geometric top center of the processor. Analysis indicates that real applications are unlikely to cause the processor to consume maximum power dissipation for sustained time periods. Intel recommends that complete thermal solution designs target the Thermal Design Power (TDP) indicated in Table 26 instead of the maximum processor power consumption. The Thermal Monitor feature is designed to protect the processor in the unlikely event that an application exceeds the TDP recommendation for a sustained periods of time. For more details on the usage of this feature, see Section 5.2. In all cases the Thermal Monitor or Thermal Monitor 2 feature must be enabled for the processor to remain within specification. Table 26. Processor Thermal Specifications Processor Number Core Frequency (GHz) Thermal Design Power (W)3,4 Extended HALT Power (W)1 Deeper Sleep Power (W)2 775_VR_ CONFIG_06 Guidance5 Minimum Maximum TC (°C) TC (°C) Notes E5200 2.50 65.0 8 E5300 2.66 65.0 8 E5400 2.70 65.0 8 E5500 2.80 65.0 8 E5700 3.00 65.0 8 E5800 3.20 65.0 8 E6300 2.80 65.0 8 E6500 2.93 65.0 8 E6600 3.06 65.0 8 E6700 3.20 65.0 8 E6800 3.33 65.0 8 6 5 4 5 4 5 4 5 6 775_VR_CONFIG 5 6 _06 5 6 (65 W) 5 6 5 6 5 6 5 6 5 See Table 27 and Figure 14 NOTES: 1. Specification is at 36 °C TC and minimum voltage loadline. Specification is ensured by design characterization and not 100% tested. 2. Specification is at 34 °C TC and minimum voltage loadline. Specification is ensured by design characterization and not 100% tested. 3. Thermal Design Power (TDP) should be used for processor thermal solution design targets. The TDP is not the maximum power that the processor can dissipate. 4. This table shows the maximum TDP for a given frequency range. Individual processors may have a lower TDP. Therefore, the maximum TC will vary depending on the TDP of the individual processor. See Figure 14 and Table 27 for the allowed combinations of power and TC. 5. 775_VR_CONFIG_06 guidelines provide a design target for meeting future thermal requirements. 76 Datasheet

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Thermal Specifications and Design Considerations
76
Datasheet
The case temperature is defined at the geometric top center of the processor. Analysis
indicates that real applications are unlikely to cause the processor to consume
maximum power dissipation for sustained time periods. Intel recommends that
complete thermal solution designs target the Thermal Design Power (TDP) indicated in
Table 26
instead of the maximum processor power consumption. The Thermal Monitor
feature is designed to protect the processor in the unlikely event that an application
exceeds the TDP recommendation for a sustained periods of time. For more details on
the usage of this feature, see
Section 5.2
.
In all cases the Thermal Monitor or
Thermal Monitor 2 feature must be enabled for the processor to remain within
specification.
NOTES:
1.
Specification is at 36 °C T
C
and minimum voltage loadline. Specification is ensured by
design characterization and not 100% tested.
2.
Specification is at 34 °C T
C
and minimum voltage loadline. Specification is ensured by
design characterization and not 100% tested.
3.
Thermal Design Power (TDP) should be used for processor thermal solution design targets.
The TDP is not the maximum power that the processor can dissipate.
4.
This table shows the maximum TDP for a given frequency range. Individual processors
may have a lower TDP. Therefore, the maximum T
C
will vary depending on the TDP of the
individual processor. See
Figure 14
and
Table 27
for the allowed combinations of power
and T
C
.
5.
775_VR_CONFIG_06 guidelines provide a design target for meeting future thermal
requirements.
Table 26.
Processor Thermal Specifications
Processor
Number
Core
Frequency
(GHz)
Thermal
Design
Power
(W)
3,4
Extended
HALT
Power
(W)
1
Deeper
Sleep
Power
(W)
2
775_VR_
CONFIG_06
Guidance
5
Minimum
T
C
(°C)
Maximum
T
C
(°C)
Notes
E5200
E5300
E5400
E5500
E5700
E5800
E6300
E6500
E6600
E6700
E6800
2.50
2.66
2.70
2.80
3.00
3.20
2.80
2.93
3.06
3.20
3.33
65.0
65.0
65.0
65.0
65.0
65.0
65.0
65.0
65.0
65.0
65.0
8
8
8
8
8
8
8
8
8
8
8
6
4
4
4
6
6
6
6
6
6
6
775_VR_CONFIG
_06
(65 W)
5
5
5
5
5
5
5
5
5
5
5
See
Table 27
and
Figure 14