Intel X3350 Design Guide - Page 15

Package Mechanical Specifications 2.1.2 Processor Component Keep-Out Zones The processor may contain components on the substrate that define component keep-out zone requirements. A thermal and mechanical solution design must not intrude into the required keep-out zones. Do not contact the Test Pad Area with conductive material. Decoupling capacitors are typically mounted to either the topside or land-side of the package substrate. See Figure 2-2 and Figure 2-3 for keep-out zones. The location and quantity of package capacitors may change due to manufacturing efficiencies but will remain within the component keep-in. 2.1.3 Package Loading Specifications . Table 2-1. Table 2-1 provides load specifications for the processor package. These maximum limits should not be exceeded during heatsink assembly, shipping conditions, or standard use condition. Exceeding these limits during test may result in component failure. The processor substrate should not be used as a mechanical reference or loadbearing surface for thermal solutions. Processor Loading Specifications Parameter Static Compressive Load Dynamic Compressive Load Maximum 890 N [200 lbf] 1779 N [400 lbf] [max static compressive + dynamic load] Notes 1, 2, 3 1, 3, 4 Notes: 1. These specifications apply to uniform compressive loading in a direction normal to the processor IHS. 2. This is the maximum static force that can be applied by the heatsink and Independent Loading Mechanism (ILM). 3. These specifications are based on limited testing for design characterization. Loading limits are for the package constrained by the limits of the processor socket. 4. Dynamic loading is defined as an 11 ms duration average load superimposed on the static load requirement. 2.1.4 Package Handling Guidelines Table 2-2 includes a list of guidelines on package handling in terms of recommended maximum loading on the processor IHS relative to a fixed substrate. These package handling loads may be experienced during heatsink removal. Table 2-2. Package Handling Guidelines Parameter Shear Tensile Torque Maximum Recommended 70 lbs 25 lbs 35 in.lbs 2.1.5 Package Insertion Specifications The processor can be inserted into and removed from a LGA1366 socket 15 times. The socket should meet the LGA1366 requirements detailed in Section 5. August 2010 Order Number: 323107-002US Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 15