Intel X3350 Design Guide - Page 67

Intel Reference Component Validation

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Quality and Reliability Requirements Table 8-2. Server Use Conditions Environment (System Level) Use Environment Shipping and Handling Shipping and Handling Speculative Stress Condition Example Use Condition Mechanical Shock • System-level • Unpackaged • Trapezoidal • 25 g • velocity change is based on packaged weight Product weight (lbs) Non-palletized product velocity change (in/sec) < 20 lbs 250 20 to > 40 225 40 to > 80 205 80 to < 100 175 100 to < 120 145 ≥120 125 Change in velocity is based upon a 0.5 coefficient of restitution. Random Vibration • System Level • Unpackaged • 5 Hz to 500 Hz • 2.20 g RMS random • 5 Hz @ .001 g2/Hz to 20 Hz @ 0.01 g2/Hz (slope up) • 20 Hz to 500 Hz @ 0.01 g2/Hz (flat) • Random control limit tolerance is ± 3 dB Total of 12 drops per system: • 2 drops per axis • ± direction Total per system: • 10 minutes per axis • 3 axes 8.2 Note: Intel Reference Component Validation Intel tests reference components individually and as an assembly on mechanical test boards and assesses performance to the envelopes specified in previous sections by varying boundary conditions. While component validation shows a reference design is tenable for a limited range of conditions, customers need to assess their specific boundary conditions and perform reliability testing based on their use conditions. Intel reference components are also used in board functional tests to assess performance for specific conditions. The 1U thermal solution was tested but the ATCA solution was not fully tested. 8.2.1 Board Functional Test Sequence Each test sequence should start with components (baseboard, heatsink assembly, and so on) that have not been previously submitted to any reliability testing. The test sequence should always start with a visual inspection after assembly, and BIOS/Processor/memory test. The stress test should be then followed by a visual inspection and then BIOS/processor/memory test. Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 67 August 2010 Order Number: 323107-002US

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Quality and Reliability Requirements
Intel
®
Xeon
®
Processor C5500/C3500 Series and LGA1366 Socket
Thermal/Mechanical Design Guide
August 2010
67
Order Number: 323107-002US
8.2
Intel Reference Component Validation
Intel tests reference components individually and as an assembly on mechanical test
boards and assesses performance to the envelopes specified in previous sections by
varying boundary conditions.
While component validation shows a reference design is tenable for a limited range of
conditions, customers need to assess their specific boundary conditions and perform
reliability testing based on their use conditions.
Intel reference components are also used in board functional tests to assess
performance for specific conditions.
Note:
The 1U thermal solution was tested but the ATCA solution was not fully tested.
8.2.1
Board Functional Test Sequence
Each test sequence should start with components (baseboard, heatsink assembly, and
so on) that have not been previously submitted to any reliability testing.
The test sequence should always start with a visual inspection after assembly, and
BIOS/Processor/memory test. The stress test should be then followed by a visual
inspection and then BIOS/processor/memory test.
Table 8-2.
Server Use Conditions Environment (System Level)
Use Environment
Speculative Stress Condition
Example Use Condition
Shipping and Handling
Mechanical Shock
•
System-level
•
Unpackaged
•
Trapezoidal
•
25 g
•
velocity change is based on packaged weight
Total of 12 drops per
system:
•
2 drops per axis
•
± direction
Product weight (lbs)
Non-palletized product
velocity change (in/sec)
< 20 lbs
20 to > 40
40 to > 80
80 to < 100
100 to < 120
≥
120
250
225
205
175
145
125
Change in velocity is based upon a 0.5 coefficient of
restitution.
Shipping and Handling
Random Vibration
•
System Level
•
Unpackaged
•
5 Hz to 500 Hz
•
2.20 g RMS random
•
5 Hz @ .001 g
2
/Hz to 20 Hz @ 0.01 g
2
/Hz
(slope up)
•
20 Hz to 500 Hz @ 0.01 g
2
/Hz (flat)
•
Random control limit tolerance is ± 3 dB
Total per system:
•
10 minutes per axis
•
3 axes