Intel X3350 Design Guide - Page 61

Thermal Solutions 7.5.3 Power Thermal Utility The Intel® Xeon® processor C5500/C3500 series Power Thermal Utility allows power and thermal testing of the processor. The Utility will allow power and thermal testing of the processor. The thermal solution must be designed to keep the processor Tcase within specification for the Thermal Design Power (TDP) as specified in Section 6. Contact your Intel representative to obtain the latest revision of the PTU. The default power level from the drop down list represents TDP. 7.6 Thermal Features More information regarding processor thermal features is contained in the appropriate Datasheet. 7.6.1 Fan Speed Control There are many ways to implement fan speed control. Using processor ambient temperature (in addition to Digital Thermal Sensor) to scale fan speed with ambient temperature can improve acoustics when DTS > TCONTROL. Table 7-2. Fan Speed Control, TCONTROL and DTS Relationship Condition FSC Scheme DTS ≤ TCONTROL FSC can adjust fan speed to maintain DTS ≤ TCONTROL (low acoustic region). DTS > TCONTROL sFpSeCcisfhicoautilodnad(ijnucsrtefaasnedspaeceodusttoickreeegpioTnC)A.SE at or below the Thermal Profile 7.6.1.1 TCONTROL Guidance Factory configured TCONTROL values are available in the appropriate Dear Customer Letter or may be extracted by issuing a Mailbox or an RDMSR instruction. See the appropriate Electrical, Mechanical, and Thermal Specifications (EMTS) for more information. Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 61 August 2010 Order Number: 323107-002US