Intel X3350 Design Guide - Page 68

Quality and Reliability Requirements 8.2.2 8.2.3 8.3 Post-Test Pass Criteria The post-test pass criteria are: • No significant physical damage to the heatsink and retention hardware. • Heatsink remains seated and its bottom remains mated flat against the IHS surface. No visible gap between the heatsink base and processor IHS. No visible tilt of the heatsink with respect to the retention hardware. • No signs of physical damage on baseboard surface due to impact of heatsink. • No visible physical damage to the processor package. • Successful BIOS/processor/memory test of post-test samples. • Thermal compliance testing to demonstrate that the case temperature specification can be met. Recommended BIOS/Processor/Memory Test Procedures This test ensures proper operation of the product before and after environmental stresses, with the thermal mechanical enabling components assembled. The test shall be conducted on a fully operational baseboard that has not been exposed to any battery of tests prior to the test being considered. Test setup should include the following components, properly assembled and/or connected: • Appropriate system baseboard. • Processor and memory. • All enabling components, including socket and thermal solution parts. The pass criterion is that the system under test shall successfully complete the checking of BIOS, basic processor functions, and memory, without any errors. Intel PC Diags is an example of software that can be utilized for this test. Material and Recycling Requirements Material shall be resistant to fungal growth. Examples of non-resistant materials include cellulose materials, animal and vegetable based adhesives, grease, oils, and many hydrocarbons. Synthetic materials such as PVC formulations, certain polyurethane compositions (for example, polyester and some polyethers), plastics which contain organic fillers of laminating materials, paints, and varnishes also are susceptible to fungal growth. If materials are not fungal growth resistant, then MILSTD-810E, Method 508.4 must be performed to determine material performance. Any plastic component exceeding 25 gm should be recyclable per the European Blue Angel recycling standards. The following definitions apply to the use of the terms lead-free, Pb-free, and RoHS compliant. Lead-free and Pb-free: Lead has not been intentionally added, but lead may still exist as an impurity below 1000 ppm. August 2010 Order Number: 323107-002US Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 68