Intel X3350 Design Guide - Page 35

LGA1366 Socket and ILM Electrical, Mechanical and Environmental Specifications 5.6 Environmental Requirements Design, including materials, shall be consistent with the manufacture of units that meet the following environmental reference points. The reliability targets in this section are based on the expected field use environment for these products. The test sequence for new sockets will be developed using the knowledge-based reliability evaluation methodology, which is acceleration factor dependent. A simplified process flow of this methodology can be seen in Figure 5-2. Figure 5-2. Flow Chart of Knowledge-Based Reliability Evaluation Methodology Establish the market/expected use environment for the technology Develop Speculative stress conditions based on historical data, content experts, and literature search Freeze stressing requirements and perform additional data turns Perform stressing to validate accelerated stressing assumptions and determine acceleration factors A detailed description of this methodology is at: ftp://download.intel.com/technology/itj/q32000/pdf/reliability.pdf. § August 2010 Order Number: 323107-002US Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 35