Intel X3350 Design Guide - Page 24

LGA1366 Socket 3.5 3.6 3.7 3.8 3.9 Durability The socket must withstand 30 cycles of processor insertion and removal. The max chain contact resistance from Table 5-4 must be met when mated in the 1st and 30th cycles. The socket Pick and Place cover must withstand 15 cycles of insertion and removal. Markings There are three markings on the socket: • LGA1366: Font type is Helvetica Bold - minimum 6 point (2.125 mm). • Manufacturer's insignia (font size at supplier's discretion). • Lot identification code (allows traceability of manufacturing date and location). All markings must withstand 260° C for 40 seconds (typical reflow/rework profile) without degrading, and must be visible after the socket is mounted on the motherboard. LGA1366 and the manufacturer's insignia are molded or laser marked on the side wall. Component Insertion Forces Any actuation must meet or exceed SEMI S8-95 Safety Guidelines for Ergonomics/ Human Factors Engineering of Semiconductor Manufacturing Equipment, example Table R2-7 (Maximum Grip Forces). The socket must be designed so that it requires no force to insert the package into the socket. Socket Size Socket information needed for motherboard design is given in Appendix C. This information should be used in conjunction with the reference motherboard keepout drawings provided in Appendix B to ensure compatibility with the reference thermal mechanical components. LGA1366 Socket NCTF Solder Joints Intel has defined selected solder joints of the socket as non-critical to function (NCTF) when evaluating package solder joints post environmental testing. The processor signals at NCTF locations are typically redundant ground or non-critical reserved, so the loss of the solder joint continuity at end of life conditions will not affect the overall product functionality. Figure 3-7 identifies the NCTF solder joints. August 2010 Order Number: 323107-002US Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 24