Intel X3350 Design Guide - Page 4

6.2.3 THERMTRIP# Signal 51 6.3 Platform Environment Control Interface (PECI 51 6.3.1 Introduction 51 6.3.2 PECI Specifications 53 7 Thermal Solutions ...54 7.1 Performance Targets 54 7.2 Heat Pipe Considerations 56 7.3 Assembly...57 7.3.1 Thermal Interface Material (TIM 58 7.4 Structural Considerations 58 7.5 Thermal Design 59 7.5.1 Thermal Characterization Parameter 59 7.5.2 NEBS Thermal Profile 60 7.5.3 Power Thermal Utility 61 7.6 Thermal Features 61 7.6.1 Fan Speed Control 61 7.6.2 PECI Averaging and Catastrophic Thermal Management 62 7.6.3 Intel® Turbo Boost Technology 62 7.6.4 Absolute Processor Temperature 63 7.6.5 Custom Heat Sinks For UP ATCA 63 8 Quality and Reliability Requirements 66 8.1 Use Conditions 66 8.2 Intel Reference Component Validation 67 8.2.1 Board Functional Test Sequence 67 8.2.2 Post-Test Pass Criteria 68 8.2.3 Recommended BIOS/Processor/Memory Test Procedures 68 8.3 Material and Recycling Requirements 68 A Component Suppliers 70 B Mechanical Drawings 72 C Socket Mechanical Drawings 89 Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 4 August 2010 Order Number: 323107-002US