Ricoh AC205 Service Manual - Page 23

ESD PRECAUTIONS, CAUTION, Ensure that no power is applied to the chassis or circuit, and observe all

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ESD PRECAUTIONS Certain semiconductor devices can be easily damaged by static electricity. Such components are commonly called "Electro-statically Sensitive (ES) Devices", or ESDs. Examples of typical ESDs are: integrated circuits, some field-effect transistors, and semiconductor "chip" components. The techniques outlined below should be followed to help reduce the incidence of component damage caused by static electricity. CAUTION Ensure that no power is applied to the chassis or circuit, and observe all other safety precautions. 1. Immediately before handling a semiconductor component or semiconductorequipped assembly, drain any electrostatic charge on your body by touching a known earth ground. Alternatively, employ a commercially available wrist strap device, which for your personal safety should be removed prior to applying power to the unit under test. 2. After removing an electrical assembly equipped with ESDs, place the assembly on a conductive surface, such as aluminum or copper foil, or conductive foam, to prevent electrostatic charge buildup in the vicinity of the assembly. 3. Use only a grounded-tip soldering iron to solder or desolder ESDs. 4. Use only an "anti-static" solder removal device. Some solder removal devices not classified as "anti-static" can generate electrical charges sufficient to damage ESDs. 5. Do not use Freon-propelled chemicals. When sprayed, these can generate electrical charges sufficient to damage ESDs. 6. Do not remove a replacement ESD from its protective packaging until immediately before installing it. Most replacement ESDs are packaged with all leads shorted together by conductive foam, aluminum foil, or a comparable conductive material. 7. Immediately before removing the protective material from the leads of a replacement ESD, touch the protective material to the chassis or circuit assembly into which the device will be installed. 8. Maintain continuous electrical contact between the ESD and the assembly into which it will be installed, until the ESD or assembly is completely plugged or soldered into the circuit. 9. Minimize bodily motions when handling unpackaged replacement ESDs. Normal motions, such as the brushing together of clothing fabric and lifting one's foot from a carpeted floor, can generate static electricity sufficient to damage an ESD.

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ESD PRECAUTIONS
Certain semiconductor devices can be easily damaged by static electricity. Such
components are commonly called “Electro-statically Sensitive (ES) Devices”, or
ESDs. Examples of typical ESDs are: integrated circuits, some field-effect
transistors, and semiconductor “chip” components.
The techniques outlined below should be followed to help reduce the incidence of
component damage caused by static electricity.
CAUTION
Ensure that no power is applied to the chassis or circuit, and observe all
other safety precautions.
1.
Immediately before handling a semiconductor component or semiconductor-
equipped assembly, drain any electrostatic charge on your body by touching a
known earth ground. Alternatively, employ a commercially available wrist strap
device, which for your personal safety should be removed prior to applying
power to the unit under test.
2.
After removing an electrical assembly equipped with ESDs, place the assembly
on a conductive surface, such as aluminum or copper foil, or conductive foam,
to prevent electrostatic charge buildup in the vicinity of the assembly.
3.
Use only a grounded-tip soldering iron to solder or desolder ESDs.
4.
Use only an “anti-static” solder removal device. Some solder removal devices
not classified as “anti-static” can generate electrical charges sufficient to
damage ESDs.
5.
Do not use Freon-propelled chemicals. When sprayed, these can generate
electrical charges sufficient to damage ESDs.
6.
Do not remove a replacement ESD from its protective packaging until
immediately before installing it. Most replacement ESDs are packaged with all
leads shorted together by conductive foam, aluminum foil, or a comparable
conductive material.
7.
Immediately before removing the protective material from the leads of a
replacement ESD, touch the protective material to the chassis or circuit
assembly into which the device will be installed.
8.
Maintain continuous electrical contact between the ESD and the assembly into
which it will be installed, until the ESD or assembly is completely plugged or
soldered into the circuit.
9.
Minimize bodily motions when handling unpackaged replacement ESDs.
Normal motions, such as the brushing together of clothing fabric and lifting
one’s foot from a carpeted floor, can generate static electricity sufficient to
damage an ESD.