Sony HCD-NEZ30 Service Manual - Page 3

TABLE OF CONTENTS 1. SERVICING NOTES 3 2. GENERAL 6 3. DISASSEMBLY 3-1. Disassembly Flow 8 3-2. Cabinet 8 3-3. Cabinet (Top) Section 9 3-4. Base Unit (BU-K8BD83S-WOD 9 3-5. Front Panel Section 10 3-6. Mechanical Deck (CMAL5Z235A 10 3-7. MAIN Board 11 3-8. Tuner (FM/AM 11 4. TEST MODE 12 5. MECHANICAL ADJUSTMENTS 13 6. ELECTRICAL ADJUSTMENTS 14 7. DIAGRAMS 7-1. Block Diagram - CD SERVO Section 17 7-2. Block Diagram - MAIN Section 18 7-3. Printed Wiring Board - CD Board 20 7-4. Schematic Diagram - CD Board 21 7-5. Printed Wiring Boards - MAIN Section 22 7-6. Schematic Diagram - MAIN Section (1/2 23 7-7. Schematic Diagram - MAIN Section (2/2 24 7-8. Printed Wiring Board - PANEL Board 26 7-9. Schematic Diagram - PANEL Board 27 7-10. Printed Wiring Boards - DC Section 28 7-11. Printed Wiring Board - AC Board 29 7-12. Schematic Diagram - POWER SUPPLY Section - ........ 30 8. EXPLODED VIEWS 8-1. Cabinet Section 36 8-2. Mechanical Deck Section 37 8-3. Panel Board Section 38 8-4. Cabinet (Top) Section 39 8-5. MAIN Board Section 40 8-6. AC Board, DC Board Section 41 9. ELECTRICAL PARTS LIST 42 Refer to SUPPLEMENT-1 for the MAIN board of printed wiring board, schematic diagram and electrical parts list of except US and Canadian models. When repairing the set of US and Canadian models, refer to either of original service manual/SUPPLEMENT-1 according to the set. Refer to SUPPLEMENT-1 for the CD board of printed wiring board, schematic diagram and electrical parts list of UK and East European models. When repairing the set of except UK and East European models, refer to either of original service manual/SUPPLEMENT-1 according to the set. Refer to SUPPLEMENT-2 for the HEAD PHONE board of printed wiring board, schematic diagram and electrical parts list of UK and East European models. When repairing the set of except UK and East European models, refer to either of original service manual/SUPPLEMENT-2 according to the set. Refer to SUPPLEMENT-3 for the PANEL board of printed wiring board, schematic diagram and electrical parts list of UK and East European models. When repairing the set of except UK and East European models, refer to either of original service manual/SUPPLEMENT-3 according to the set. HCD-NEZ30 SECTION 1 Ver. 1.5 SERVICING NOTES NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT The laser diode in the optical pick-up block may suffer electrostatic break-down because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body. During repair, pay attention to electrostatic break-down and also use the procedure in the printed matter which is included in the repair parts. The flexible board is easily damaged and should be handled with care. NOTES ON LASER DIODE EMISSION CHECK The laser beam on this model is concentrated so as to be focused on the disc reflective surface by the objective lens in the optical pickup block. Therefore, when checking the laser diode emission, observe from more than 30 cm away from the objective lens. UNLEADED SOLDER Boards requiring use of unleaded solder are printed with the leadfree mark (LF) indicating the solder contains no lead. (Caution: Some printed circuit boards may not come printed with the lead free mark due to their particular size) : LEAD FREE MARK Unleaded solder has the following characteristics. • Unleaded solder melts at a temperature about 40 ˚C higher than ordinary solder. Ordinary soldering irons can be used but the iron tip has to be applied to the solder joint for a slightly longer time. Soldering irons using a temperature regulator should be set to about 350 ˚C. Caution: The printed pattern (copper foil) may peel away if the heated tip is applied for too long, so be careful! • Strong viscosity Unleaded solder is more viscou-s (sticky, less prone to flow) than ordinary solder so use caution not to let solder bridges occur such as on IC pins, etc. • Usable with ordinary solder It is best to use only unleaded solder but unleaded solder may also be added to ordinary solder. 3