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Toshiba Tecra A3-S611 Maintenance Manual - Page 154

CMOS-LSI circuits are used in the module, so guard against damage from electrostatic

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5. Glass is used in the panel, so be careful not to drop it or let it strike a hard object, which could cause breakage or cracks. 6. CMOS-LSI circuits are used in the module, so guard against damage from electrostatic discharge. Be sure to wear a wrist or ankle ground when handling the module. TECRA A3/S2 Series Maintenance Manual A-3

Section	Page
Tecra A3 / S2 Maintenance Manual	1
Table of Contents	6
Chapter 1 Hardware Overview	6
Chapter 2 Troubleshooting Procedures	6
Chapter 3 Tests and Diagnostics	7
Chapter 4 Replacement Procedures	8
Appendices	9
Chapter 1 Hardware Overview	10
1.1 Features	14
1.2 System Unit	19
Marvell 88E8053 for Giga LAN	22
Marvell 88E8036 for 10/100M LAN	22
Marvell 88SA8040 for Serial ATA Bridge	22
1.3 2.5-inch Hard Disk Drive	23
1.1	23
1.4 Optical Devices module	24
1.4.1 DVD-ROM Drive	24
1.4.2 CD-ROM Drive	24
1.4.3 CD-RW/DVD-ROM Drive	25
1.4.4 DVD±R/±RW Drive	26
1.4.5 DVD Super Multi Drive	26
1.5 Power Supply	28
1.6 Batteries	30
1.6.1 Main Battery	30
1.6.2 RTC battery	31
Chapter 2 Troubleshooting Procedures	32
Contents	34
2.1 Troubleshooting Introduction	36
2.2 Troubleshooting Flowchart	37
2.3 Power Supply Troubleshooting	42
2.4 Display Troubleshooting	47
2.5 Keyboard Troubleshooting	50
2.6 External USB Devices Troubleshooting	52
2.7 TV-Out Failure Troubleshooting	54
2.8 Printer Port Troubleshooting	56
2.9 TouchPad Troubleshooting	58
2.10 Speaker Troubleshooting	60
2.11 Modem Troubleshooting	62
2.12 PCMCIA Troubleshooting	64
2.13 IEEE 1394 Troubleshooting	66
2.14 Wireless LAN Troubleshooting	69
Chapter 3 Tests and Diagnostics	72
Contents	74
3.1 The Diagnostic Test	76
3.2 Executing the Diagnostic Test	77
3.3 Config Check Test	81
3.4 DMI Check Test	82
3.5 PIO Loopback Test	83
3.6 Speaker Audio Test	85
3.7 Fan ON/OFF Test	86
3.8 Main Battery Charge Test	87
3.9 FDD Test	88
3.10 CD-ROM Test	89
3.11 Keyboard Test	90
3.12 Mouse (Pad) Test	92
3.13 LCD Pixels Mode Test	94
3.14 Lid Switch Test	95
3.15 HDD R/W Test	96
3.16 LAN Test	98
3.17 RTC Test	102
Chapter 4 Replacement Procedures	103
Contents	105
4.1 General	108
4.2 Battery	114
4.3 PC Card	115
4.4 HDD	116
4.5 Optical Drive Module	119
4.6 Optical Drive	120
4.7 Wireless LAN	122
4.8 Expansion Memory Module	124
4.9 Keyboard	128
4.10 Bluetooth	131
4.11 Modem	132
4.12 Display Assembly	133
4.13 Top Cover	135
4.14 Touch Pad	138
4.15 Speakers	139
4.16 System Board	140
4.17 Direct Play Button Board	143
4.18 Fan, Heat Sink, & CPU	144
4.19 Display Mask	147
4.20 LCD Module	149
4.21 FL Inverter Board	151
Appendix A Handling the LCD Module	152
Appendix B Board Layout	158
B.1 System Board (FRDSY*) Top View	158
B.2 System Board (FRDSY*) Button View	159
System Board ICs	160
Appendix C Pin Assignments	162
C.1 JP24,JP25	162
C.2 JP1	166
C.3 JP18	167
C.4 JP31	168
C.5 JP19	169
C.6 JP28	172
C.7 JP6	175
C.8 JP29	176
C.9 JP12	177
C.10 PJP1	177
C.11 JP21	178
C.12 JP22	178
Appendix D Keyboard Scan/Character Codes	179
Appendix E Key Layout	187
E.1 United States (US) Keyboard	187
E.2 United Kingdom (UK) Keyboard	188
E.3 Spanish (SP) Keyboard	189
E.4 Japanese (JA) Keyboard	189
E.5 Korean (KO) Keyboard	190
E.6 French (FR) Keyboard	191
E.7 French-Canadian Keyboard	192
E.8 Portuguese Keyboard	192
E.9 US-INTERNATIONAL Keyboard	193
E.10 Greece(GR) Keyboard	193
E.11 Chinese-T Keyboard	194
E.12 Swedish Keyboard	194
E.13 ITALIAN Keyboard	195
E.14 CZECH Keyboard	195
Appendix F Series Screw Torque List	197