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HP 6100 HP 4x00/6x00/8x00 Enterprise Virtual Array User Guide (5697-0733, Marc - Page 59

Rack configurations, Power distribution - ps

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• Unique frame and rail design - Allows fast assembly, easy mounting, and outstanding structural integrity. • Thermal integrity - Front-to-back natural convection cooling is greatly enhanced by the innovative multi-angled design of the front door. • Security provisions - The front and rear door are lockable, which prevents unauthorized entry. • Flexibility - Provides easy access to hardware components for operation monitoring. • Custom expandability - Several options allow for quick and easy expansion of the racks to create a custom solution. Rack configurations Each system configuration depends on the number of disk enclosures included in the storage system. For more information about racks and configurations, including expansion and interconnection, see the HP Enterprise Virtual Array Hardware Configuration Guide. Power distribution AC power is distributed to the rack through a dual Power Distribution Unit (PDU) assembly mounted at the bottom rear of the rack. The characteristics of the fully-redundant rack power configuration are as follows: • Each PDU is connected to a separate circuit breaker-protected, 30-A AC site power source (220-240 VAC ±10%, 50 or 60-Hz, ±5%). Figure 26 (page 59) illustrates the compatible 60-Hz and 50-Hz wall receptacles. Figure 26 60-Hz and 50-Hz wall receptacles NEMA L6-30R receptacle, 3-wire, 30-A, 60-Hz IEC 309 receptacle, 3-wire, 30-A, 50-Hz • The standard power configuration for any Enterprise Virtual Array rack is the fully redundant configuration. Implementing this configuration requires: ◦ Two separate circuit breaker-protected, 30-A site power sources with a compatible wall receptacle (see Figure 26 (page 59)). ◦ One dual PDU assembly. Each PDU connects to a different wall receptacle. ◦ Six Power Distribution Modules (PDM) per rack. Three PDMs mount vertically on each side of the rack. Each set of PDMs connects to a different PDU. ◦ The drive enclosure power supplies on the left (PS 1) connect to the PDMs on the left with a gray, 66 cm (26 in) power cord. ◦ The drive enclosure power supplies on the right (PS 2) connect to the PDMs on the right with a black, 66 cm (26 in) power cord. Racks 59

Section	Page
HP 4x00/6x00/8x00 Enterprise Virtual Array User Guide	1
Contents	3
1 Enterprise Virtual Array description	12
Features	12
Ease of management	12
Data availability	13
Performance	13
Scalability	13
Operating system support	14
HP Insight Remote Support software	14
Storage system components	14
HP Command View EVA	15
Controller software	15
XCS features and functionality	15
Optional software licensing	16
Hardware	16
Physical layout of the storage system	16
2 Enterprise Virtual Array startup	18
EVA8000/8100 storage system connections	18
EVA6000/6100 storage system connections	19
EVA4000/4100 storage system connections	19
Direct connect	20
iSCSI connection configurations	21
Fabric connect iSCSI	21
Direct connect iSCSI	21
Procedures for getting started	22
Gathering information	22
Host information	22
Setting up a controller pair using the OCP	22
Entering the WWN	23
Entering the WWN checksum	24
Entering the storage system password	24
Installing HP Command View EVA	25
Installing optional EVA software licenses	25
3 Enterprise Virtual Array hardware components	26
Fibre Channel drive enclosures	26
Enclosure layout	26
I/O modules	27
I/O module status indicators	27
Fiber Optic Fibre Channel cables	28
Copper Fibre Channel cables	29
Fibre Channel disk drives	29
Disk drive status indicators	30
Disk drive status displays	30
Disk drive blank	31
Power supplies and blowers	31
Power supplies	31
Blowers	32
Drive enclosure EMU	32
Controls and displays	33
EMU functions	33
EMU monitoring functions	34
EMU displays	34
EMU indicator displays	35
Using the alphanumeric display	35
Alphanumeric display description	35
Display groups	35
EMU pushbutton status indicators	36
Audible alarm operations	36
Audible alarm patterns	36
Controlling the audible alarm	37
Enabling the audible alarm	37
Muting or unmuting the audible alarm	37
Disabling the audible alarm	38
Enclosure number feature	38
En description	38
Enclosure address bus	39
Enclosure address bus connections	40
Error Condition Reporting	40
Error condition categories	41
Error queue	41
Error condition report format	42
Navigating the error condition display	42
Analyzing condition reports	43
Reporting group feature	43
Reporting group numbers	43
Fibre Channel loop switches	44
30-10022-01 loop switch	44
Power-on self test (POST)	45
30-10010-02 loop switch	45
Power-on self test (POST)	46
Reading the switch status indicators	46
Problem isolation	47
HSV controllers	47
High availability features	49
Operator control panel	49
Status indicators	50
Navigation buttons	51
Alphanumeric display	51
Displaying the OCP menu tree	51
Displaying system information	53
Displaying versions system information	53
Shutting down the system	53
Shutting the controller down	54
Restarting the system	54
Uninitializing the system	55
Password options	55
Changing a password	55
Clearing a password	56
Power supplies	56
Blowers	56
Cache battery	57
HSV controller cabling	58
Racks	58
Rack configurations	59
Power distribution	59
PDUs	60
PDU 1	61
PDU 2	61
PDMs	61
Rack AC power distribution	62
Rack System/E power distribution components	62
Rack AC power distribution	62
Moving and stabilizing a rack	63
4 Enterprise Virtual Array operation	65
Best practices	65
Operating tips and information	65
Reserving adequate free space	65
Using FATA disk drives	65
Changing the host port topology	65
Host port connection limit on B-series 3200 and 3800 switches	65
Enabling Boot from SAN for Windows direct connect	66
Windows 2003 MSCS cluster installation	66
Connecting to C-series switches	66
Failback preference setting for HSV controllers	67
Changing virtual disk failover/failback setting	69
Storage system shutdown and startup	69
Shutting down the storage system	69
Starting the storage system	70
Saving storage system configuration data	70
Adding disk drives to the storage system	72
Guidelines for adding disk drives	72
Creating disk groups	73
Adding a disk drive	74
Removing the drive blank	74
Changing the Device Addition Policy	74
Installing the disk drive	75
Checking status indicators	75
Adding the disk to a disk group	76
Handling fiber optic cables	76
5 Configuring application servers	78
Overview	78
Clustering	78
Multipathing	78
Installing Fibre Channel adapters	78
Testing connections to the EVA	78
Adding hosts	79
Creating and presenting virtual disks	79
Verifying virtual disk access from the host	80
Configuring virtual disks from the host	80
HP-UX	80
Scanning the bus	80
Creating volume groups on a virtual disk using vgcreate	81
IBM AIX	81
Accessing IBM AIX utilities	81
Adding hosts	82
Creating and presenting virtual disks	82
Verifying virtual disks from the host	82
Linux	83
Driver failover mode	83
Installing a Qlogic driver	83
Upgrading Linux components	84
Upgrading qla2x00 RPMs	84
Detecting third-party storage	84
Compiling the driver for multiple kernels	85
Uninstalling the Linux components	85
Using the source RPM	85
Verifying virtual disks from the host	86
OpenVMS	86
Updating the AlphaServer console code, Integrity Server console code, and Fibre Channel FCA firmware	86
Verifying the Fibre Channel adapter software installation	86
Console LUN ID and OS unit ID	86
Adding OpenVMS hosts	87
Scanning the bus	88
Configuring virtual disks from the OpenVMS host	89
Setting preferred paths	89
Sun Solaris	89
Loading the operating system and software	89
Configuring FCAs with the Sun SAN driver stack	89
Configuring Emulex FCAs with the lpfc driver	90
Configuring QLogic FCAs with the qla2300 driver	91
Fabric setup and zoning	93
Sun StorEdge Traffic Manager (MPxIO)/Sun Storage Multipathing	93
Configuring with Veritas Volume Manager	93
Configuring virtual disks from the host	95
Verifying virtual disks from the host	96
Labeling and partitioning the devices	97
VMware	98
Installing or upgrading VMware	98
Configuring the EVA with VMware host servers	98
Configuring an ESX server	99
Loading the FCA NVRAM	99
Setting the multipathing policy	99
Specifying DiskMaxLUN	100
Verifying connectivity	100
Verifying virtual disks from the host	101
6 Customer replaceable units	102
Customer self repair (CSR)	102
Parts only warranty service	102
Best practices for replacing hardware components	102
Component replacement videos	102
Verifying component failure	102
Procuring the spare part	102
Replaceable parts	103
Replacing the failed component	106
Returning the defective part	106
7 Support and other resources	107
Contacting HP	107
Subscription service	107
Documentation feedback	107
Related information	107
Documents	107
Websites	107
Document conventions and symbols	108
Rack stability	108
Customer self repair	109
A Regulatory notices and specifications	110
Regulatory notices	110
Federal Communications Commission (FCC) notice	110
FCC Class A certification	110
Class A equipment	110
Class B equipment	110
Declaration of conformity for products marked with the FCC logo, United States only	111
Modifications	111
Cables	111
Laser device	111
Laser safety warnings	111
Compliance with CDRH regulations	111
Certification and classification information	112
Canadien notice (avis Canadien)	112
Class A equipment	112
Class B equipment	112
European union notice	112
Notice for France	112
WEEE Recycling Notices	113
English notice	113
Dutch notice	113
Czechoslovakian notice	113
Estonian notice	113
Finnish notice	113
French notice	114
German notice	114
Greek notice	114
Hungarian notice	115
Italian notice	115
Latvian notice	115
Lithuanian notice	115
Polish notice	116
Portuguese notice	116
Slovakian notice	116
Slovenian notice	116
Spanish notice	116
Swedish notice	117
Germany noise declaration	117
Japanese notice	117
Harmonics conformance (Japan)	117
Taiwanese notice	117
Japanese power cord notice	118
Country-specific certifications	118
Storage system specifications	118
Physical specifications	118
Environmental specifications	118
Power specifications	119
B EMU-generated condition reports	122
Condition report format	122
Correcting errors	122
Drive conditions	123
0.1.en.01 CRITICAL condition—Drive configuration or drive link rate	123
0.1.en.02 INFORMATION condition—Drive missing	124
0.1.en.03 INFORMATION condition—Drive software lock active	124
0.1.en.04 CRITICAL condition—Loop a drive link rate incorrect	124
0.1.en.05 CRITICAL condition—Loop b drive link rate incorrect	125
Power supply conditions	125
0.2.en.01 NONCRITICAL Condition—Power supply AC input missing	125
0.2.en.02 UNRECOVERABLE condition—Power supply missing	126
0.2.en.03 CRITICAL condition—Power supply load unbalanced	126
Blower conditions	126
0.3.en.01 NONCRITICAL condition—Blower speed	127
0.3.en.02 CRITICAL condition—Blower speed	127
0.3.en.03 UNRECOVERABLE condition—Blower failure	127
0.3.en.04 UNRECOVERABLE condition—Blower internal	127
0.3.en.05 NONCRITICAL condition—Blower missing	127
0.3.en.06 UNRECOVERABLE condition—No blowers installed	128
Temperature conditions	128
0.4.en.01 NONCRITICAL condition—High temperature	128
0.4.en.02 CRITICAL condition—High temperature	129
0.4.en.03 NONCRITICAL condition—Low temperature	129
0.4.en.04 CRITICAL condition—Low temperature	129
0.4.en.05 UNRECOVERABLE condition—High temperature	129
EMU conditions	130
Resetting the EMU	130
07.01.01 CRITICAL condition—EMU internal clock	130
07.01.02 UNRECOVERABLE condition—EMU interrupted	130
0.7.01.03 UNRECOVERABLE Condition—Power supply shutdown	131
0.7.01.04 INFORMATION condition—EMU internal data	131
0.7.01.05 UNRECOVERABLE condition—Backplane NVRAM	131
0.7.01.10 NONCRITICAL condition—NVRAM invalid read data	131
0.7.01.11 NONCRITICAL condition—EMU NVRAM write failure	131
0.7.01.12 NONCRITICAL condition—EMU cannot read NVRAM data	132
0.7.01.13 UNRECOVERABLE condition—EMU load failure	132
0.7.01.14 NONCRITICAL condition—EMU enclosure address	132
0.7.01.15 UNRECOVERABLE condition—EMU hardware failure	132
0.7.01.16 INFORMATION condition—EMU internal ESI data corrupted	133
0.7.01.17 UNRECOVERABLE condition—Power shutdown failure	133
0.7.01.18 UNRECOVERABLE condition—EMU hardware failure	133
0.7.01.19 UNRECOVERABLE condition—EMU ESI driver failure	133
Transceiver conditions	134
0.F.en.01 CRITICAL condition—Transceiver incompatibility	134
0.F.en.02 CRITICAL condition—Transceiver data signal lost	134
0.F.en.03 CRITICAL condition—Transceiver fibre channel drive enclosure bus fault	134
0.F.en.04 CRITICAL condition—Transceiver removed	134
0.F.en.05 CRITICAL condition—Invalid fibre channel character	135
CAN bus communication port conditions	135
Resetting the EMU	135
1.1.03.01 NONCRITICAL condition—Communication error	135
1.1.03.02 INFORMATION condition—Recovery completed	136
1.1.03.03 INFORMATION condition—Overrun recovery	136
Voltage sensor and current sensor conditions	136
1.2.en.01 NONCRITICAL condition—High voltage	136
1.2.en.02 CRITICAL condition—High voltage	136
1.2.en.03 NONCRITICAL condition—Low voltage	137
1.2.en.04 CRITICAL condition—Low voltage	137
1.3.en.01 NONCRITICAL condition—High current	137
1.3.en.02 CRITICAL condition—High current	137
Backplane conditions	137
8.2.01.10 NONCRITICAL condition—Backplane NVRAM read	137
8.2.01.11 NONCRITICAL condition—Backplane NVRAM write failure	137
8.2.01.12 NONCRITICAL condition—Backplane NVRAM read failure	138
8.2.01.13 NONCRITICAL condition—Backplane WWN is blank	138
I/O Module conditions	138
8.7.en.01 CRITICAL condition—I/O module unsupported	138
8.7.en.02 CRITICAL condition—I/O module communication	138
8.7.en.10 NONCRITICAL condition—I/O module NVRAM read	138
8.7.en.11 NONCRITICAL condition—I/O module NVRAM write	139
8.7.en.12 NONCRITICAL condition—I/O Module NVRAM read failure	139
8.7.en.13 NONCRITICAL condition—I/O module removed	139
Host conditions	139
C Controller fault management	140
Using HP Command View EVA	140
GUI termination event display	140
GUI event display	140
Fault management displays	141
Displaying Last Fault Information	141
Displaying Detailed Information	141
Interpreting fault management information	142
D Non-standard rack specifications	143
Rack specifications	143
Internal component envelope	143
EIA310-D standards	143
EVA cabinet measures and tolerances	143
Weights, dimensions and component CG measurements	143
Airflow and Recirculation	144
Component Airflow Requirements	144
Rack Airflow Requirements	144
Configuration Standards	144
Environmental and operating specifications	145
Power requirements	145
UPS Selection	146
Environmental specifications	148
Shock and vibration specifications	149
E Single Path Implementation	150
High-level solution overview	150
Benefits at a glance	150
Installation requirements	151
Recommended mitigations	151
Supported configurations	151
General configuration components	151
Connecting a single path HBA server to a switch in a fabric zone	151
HP-UX configuration	153
Requirements	153
HBA configuration	153
Risks	153
Limitations	153
Windows Server (32-bit) configuration	154
Requirements	154
HBA configuration	154
Risks	154
Limitations	154
Windows Server (64-bit) configuration	155
Requirements	155
HBA configuration	155
Risks	155
Limitations	155
SUN Solaris configuration	156
Requirements	156
HBA configuration	156
Risks	156
Limitations	157
Tru64 UNIX configuration	157
Requirements	157
HBA configuration	157
Risks	158
OpenVMS configuration	158
Requirements	158
HBA configuration	158
Risks	159
Limitations	159
Linux (32-bit) configuration	159
Requirements	159
HBA configuration	159
Risks	160
Limitations	160
Linux (64-bit) configuration	160
Requirements	160
HBA configuration	160
Risks	161
Limitations	161
IBM AIX configuration	161
Requirements	161
HBA configuration	161
Risks	162
Limitations	162
VMware configuration	162
Requirements	162
HBA configuration	163
Risks	163
Limitations	163
Failure scenarios	163
HP-UX	163
Windows Server	164
Sun Solaris	164
OpenVMS and Tru64 UNIX	165
Linux	165
IBM AIX	166
VMware	166
Glossary	168

Match case Limit results 1 per page

•

Unique frame and rail design — Allows fast assembly, easy mounting, and outstanding

structural integrity.

•

Thermal integrity — Front-to-back natural convection cooling is greatly enhanced by the

innovative multi-angled design of the front door.

•

Security provisions — The front and rear door are lockable, which prevents unauthorized

entry.

•

Flexibility — Provides easy access to hardware components for operation monitoring.

•

Custom expandability — Several options allow for quick and easy expansion of the racks to

create a custom solution.

Rack configurations

Each system configuration depends on the number of disk enclosures included in the storage system.

For more information about racks and configurations, including expansion and interconnection,

see the

HP Enterprise Virtual Array Hardware Configuration Guide

Power distribution

AC power is distributed to the rack through a dual Power Distribution Unit (PDU) assembly mounted

at the bottom rear of the rack. The characteristics of the fully-redundant rack power configuration

are as follows:

•

Each PDU is connected to a separate circuit breaker-protected, 30-A AC site power source

(220–240 VAC ±10%, 50 or 60-Hz, ±5%).

Figure 26 (page 59)

illustrates the compatible

60-Hz and 50-Hz wall receptacles.

Figure 26 60-Hz and 50-Hz wall receptacles

NEMA L6-30R receptacle, 3-wire, 30-A, 60-Hz

IEC 309 receptacle, 3-wire, 30-A, 50-Hz

•

The standard power configuration for any Enterprise Virtual Array rack is the fully redundant

configuration. Implementing this configuration requires:

◦

Two separate circuit breaker-protected, 30-A site power sources with a compatible wall

receptacle (see

Figure 26 (page 59)

◦

One dual PDU assembly. Each PDU connects to a different wall receptacle.

◦

Six Power Distribution Modules (PDM) per rack. Three PDMs mount vertically on each

side of the rack. Each set of PDMs connects to a different PDU.

◦

The drive enclosure power supplies on the left (PS 1) connect to the PDMs on the left with

a gray, 66 cm (26 in) power cord.

◦

The drive enclosure power supplies on the right (PS 2) connect to the PDMs on the right

with a black, 66 cm (26 in) power cord.

Racks