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Intel DG965WH Product Specification - Page 68

Reliability, Environmental

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Intel Desktop Board DG965WH Technical Product Specification 2.13 Reliability The Mean Time Between Failures (MTBF) prediction is calculated using component and subassembly random failure rates. The calculation is based on the Bellcore Reliability Prediction Procedure, TR-NWT-000332, Issue 4, September 1991. The MTBF prediction is used to estimate repair rates and spare parts requirements. The MTBF data is calculated from predicted data at 55 ºC. The Desktop Board DG965WH MTBF is 123,402 hours. 2.14 Environmental Table 35 lists the environmental specifications for the board. Table 35. Desktop Board DG965WH Environmental Specifications Parameter Specification Temperature Non-Operating Operating -40 °C to +70 °C 0 °C to +55 °C Shock Unpackaged 50 g trapezoidal waveform Velocity change of 170 inches/second² Packaged Half sine 2 millisecond Product weight (pounds) Free fall (inches) Velocity change (inches/sec²)

Section	Page
Intel® Desktop Board DG965WH Technical Product Specification	1
Revision History / Disclaimer	2
Preface	3
Intended Audience	3
What This Document Contains	3
Typographical Conventions	3
Contents	5
1 Product Description	9
1.1 Overview	10
1.1.1 Feature Summary	10
1.1.2 Manufacturing Options	11
1.1.3 Board Layout	12
1.1.4 Block Diagram	14
1.2 Online Support	15
1.3 Processor	15
1.4 System Memory	16
1.4.1 Memory Configurations	17
1.5 Intel® G965 Express Chipset	23
1.5.1 Intel G965 Graphics Subsystem	23
1.5.2 USB	25
1.5.3 Serial ATA Interfaces	26
1.5.4 Parallel IDE Interface	27
1.5.5 Real-Time Clock, CMOS SRAM, and Battery	27
1.6 Legacy I/O Controller	28
1.6.1 Serial Port	28
1.6.2 Parallel Port	28
1.6.3 Diskette Drive Controller	28
1.6.4 Keyboard and Mouse Interface (Optional)	28
1.7 Audio Subsystem	29
1.7.1 Audio Subsystem Software	30
1.7.2 Audio Connectors and Headers	30
1.8 LAN Subsystem	31
1.8.1 Intel® 82566DC Gigabit Ethernet Controller	31
1.8.2 LAN Subsystem Software	32
1.8.3 RJ-45 LAN Connector with Integrated LEDs	32
1.9 Hardware Management Subsystem	33
1.9.1 Hardware Monitoring and Fan Control	33
1.9.2 Fan Monitoring	33
1.9.3 Chassis Intrusion and Detection	33
1.9.4 Thermal Monitoring	34
1.10 Power Management	35
1.10.1 ACPI	35
1.10.2 Hardware Support	37
2 Technical Reference	43
2.1 Memory Map	43
2.1.1 Addressable Memory	43
2.2 DMA Channels	45
2.3 Fixed I/O Map	46
2.4 PCI Configuration Space Map	47
2.5 Interrupts	48
2.6 DMA Channels	49
2.7 PCI Interrupt Routing Map	49
2.8 Connectors and Headers	50
2.8.1 Back Panel Connectors	51
2.8.2 Component-side Connectors and Headers	52
2.9 Jumper Block	60
2.10 Mechanical Considerations	61
2.10.1 Form Factor	61
2.10.2 I/O Shield	62
2.11 Electrical Considerations	64
2.11.1 DC Loading	64
2.11.2 Fan Header Current Capability	64
2.11.3 Add-in Board Considerations	65
2.11.4 Power Supply Considerations	65
2.12 Thermal Considerations	66
2.13 Reliability	68
2.14 Environmental	68
3 Overview of BIOS Features	69
3.1 Introduction	69
3.2 BIOS Flash Memory Organization	70
3.3 Resource Configuration	70
3.3.1 PCI Autoconfiguration	70
3.3.2 PCI IDE Support	71
3.4 System Management BIOS (SMBIOS)	71
3.5 Legacy USB Support	72
3.6 BIOS Updates	72
3.6.1 Language Support	73
3.6.2 Custom Splash Screen	73
3.7 BIOS Recovery	73
3.8 Boot Options	74
3.8.1 CD-ROM Boot	74
3.8.2 Network Boot	74
3.8.3 Booting Without Attached Devices	74
3.8.4 Changing the Default Boot Device During POST	74
3.9 Adjusting Boot Speed	75
3.9.1 Peripheral Selection and Configuration	75
3.9.2 BIOS Boot Optimizations	75
3.10 BIOS Security Features	76
4 Error Messages and Beep Codes	77
4.1 Speaker	77
4.2 BIOS Beep Codes	77
4.3 BIOS Error Messages	77
4.4 Port 80h POST Codes	78
5 Regulatory Compliance and Battery Disposal Information	83
5.1 Regulatory Compliance	83
5.1.1 Safety Regulations	83
5.1.2 European Union Declaration of Conformity Statement	84
5.1.3 Product Ecology Statements	86
5.1.4 EMC Regulations	89
5.1.5 Product Certification Markings (Board Level)	90