Home » Asus Manuals » Motherboards » Asus MAXIMUS III GENE » Manual Viewer

Asus MAXIMUS III GENE User Manual - Page 46

DDR3-2000MHz capability, DDR3-2133MHz capability - specs

UPC - 610839173013

View all Asus MAXIMUS III GENE manuals

Add to My Manuals
Save this manual to your list of manuals

Page 46 highlights

Maximus III GENE Motherboard Qualified Vendors Lists (QVL) DDR3-2000MHz capability Vendor Part No. Apacer Crucial G.SKILL G.SKILL KINGSTON KINGSTON KINGSTON KINGSTON OCZ OCZ OCZ OCZ Gingle 78.0AGCQ.CBZ(XMP) BL12864BE2009.8SFB3(EPP) F3-16000CL7T-6GBPS(XMP) F3-16000CL9T-6GBPS(XMP) KHX16000D3K2/2GN(EPP) KHX16000D3K3/3GX(XMP) KHX16000D3ULT1K3/ 6GX(XMP) KHX16000D3T1K3/6GX(XMP) OCZ3FXT20002GK OCZ3P20002GK(EPP) OCZ3P2000EB2GK OCZ3B2000LV6GK 9CAASS37AZZ01D1 Size SS/ Chip DS Brand 3GB (Kit of 3) SS N/A 1GB SS N/A 6GB (Kit of 3) DS N/A 6GB (Kit of 3) DS N/A 2GB (Kit of 2) SS N/A 3GB (Kit of 3) SS N/A 6GB (Kit 0f 3) DS N/A 6GB (Kit of 3) DS N/A 2GB (Kit of 2) SS N/A 2GB (Kit of 2) SS N/A 2GB (Kit of 2) SS N/A 6GB (Kit of 3) DS N/A 2GB DS N/A Chip NO. Heat-Sink Package Heat-Sink Package Heat-Sink Package Heat-Sink Package Heat-Sink Package Heat-Sink Package Heat-Sink Package Heat-Sink Package Heat-Sink Package Heat-Sink Package Heat-Sink Package Heat-Sink Package Heat-Sink Package Timing Lable(Bios) 9-9-9-27(1066-8-8-8-20) 9-9-9-28(1333-9-9-9-24) 7-8-7-20(1066-8-8-8-20) 9-9-9-24(1066-8-8-8-20) 9(1333-9-9-9-24) Voltage N/A 2 1.65 1.65 2.0 1.65 DIMM socket support A* B* C 8(1066-8-8-8-20) 1.65 ••• 9(1066-8-8-8-20) 1.65 8 1.9 9 1.9 9-8-8(1066-8-7-7-20) 1.8 7-8-7(1066-9-9-9-24) 1.65 9-9-9-24 N/A Maximus III GENE Motherboard Qualified Vendors Lists (QVL) DDR3-2133MHz capability Vendor Part No. Size SS/ DS Chip Brand Chip NO. Timing Lable(Bios) DIMM socket support Voltage A* B* C* G.SKILL F3-17066CL9T-6GB-T 6GB (Kit of 3) DS N/A Heat-Sink Package 9-9-9-24(1066-8-7-7-20) 1.65 • • Side(s): SS - Single-sided DS - Double-sided DIMM support: • A*: Supports one (1) module inserted into slot A1 or B1 as Single-channel memory configuration. • B*: Supports two (2) modules inserted into the blue slots (A1 and B1) as one pair of Dual-channel memory configuration. • C*: Supports four (4) modules inserted into both the blue and the black slots as two pairs of Dual-channel memory configuration. • ASUS exclusively provides hyper DIMM support function. • Hyper DIMM support is subject to the physical characteristics of individual CPUs. • According to Intel spec definition, DDR3-1600 is supported for one DIMM per channel only. ASUS exclusively provides two DDR3-1600 DIMM support for each memory channel. • Visit the ASUS website for the latest QVL. 2-20 Chapter 2: Hardware information

Section	Page
Notices	8
Safety information	9
About this guide	10
Maximus III GENE specifications summary	12
Chapter 1: Product introduction	15
1.1 Welcome!	17
1.2 Package contents	17
1.3 Special features	18
1.3.1 Product highlights	18
1.3.2 ROG Intelligent Performance & Overclocking features	19
1.3.3 ROG unique features	21
1.3.4 ASUS special features	22
Chapter 2: Hardware information	25
2.1 Before you proceed	27
2.2 Motherboard overview	31
2.2.1 Motherboard layout	31
2.2.2 Layout contents	32
2.2.3 Placement direction	33
2.2.4 Screw holes	33
2.3 Central Processing Unit (CPU)	34
2.3.1 Installing the CPU	34
2.3.2 Installing the CPU heatsink and fan	37
2.3.3 Uninstalling the CPU heatsink and fan	38
2.4 System memory	39
2.4.1 Overview	39
2.4.2 Memory configurations	40
2.4.3 Installing a DIMM	47
2.4.4 Removing a DIMM	47
2.5 Expansion slots	48
2.5.1 Installing an expansion card	48
2.5.2 Configuring an expansion card	48
2.5.3 Interrupt assignments	49
2.5.4 PCI slot	50
2.5.5 PCI Express x4 slot	50
2.5.6 PCI Express 2.0 x16 slots	50
2.6 Jumper	52
2.7 I/O shield installation	53
2.8 Connectors	54
2.8.1 Rear panel connectors	54
2.8.2 Internal connectors	56
2.8.3 ASUS Q-Connector (system panel)	64
2.8.4 Onboard switches	65
2.9 Starting up for the first time	67
2.10 Turning off the computer	68
2.10.1 Using the OS shut down function	68
2.10.2 Using the dual function power switch	68
Chapter 3: BIOS setup	69
3.1 Managing and updating your BIOS	71
3.1.1 ASUS Update utility	71
3.1.2 ASUS EZ Flash 2 utility	74
3.1.3 ASUS CrashFree BIOS 3 utility	75
3.1.4 ASUS BIOS Updater	76
3.2 BIOS setup program	79
3.2.1 BIOS menu screen	80
3.2.2 Menu bar	80
3.2.3 Navigation keys	80
3.2.4 Menu items	81
3.2.5 Submenu items	81
3.2.6 Configuration fields	81
3.2.7 Pop-up window	81
3.2.8 Scroll bar	81
3.2.9 General help	81
3.3 Extreme Tweaker menu	82
3.3.1 CPU Level Up [Auto]	83
3.3.2 Memory Level Up [Auto]	83
3.3.3 Ai Overclock Tuner [Auto]	83
3.3.4 OC From CPU/Memory Level Up [Auto]	83
3.3.5 CPU Ratio Setting [Auto]	84
3.3.6 CPU Configuration	84
3.3.7 Intel(R) SpeedStep(TM) Tech [Enabled]	84
3.3.8 Intel(R) TurboMode Tech [Enabled]	84
3.3.9 QPI Frequency [Auto]	84
3.3.10 DRAM Timing Control	85
3.3.11 CPU Clock Amplitude [Auto]	86
3.3.12 PCH Clock Amplitude [Auto]	87
3.3.13 CPU Clock Skew [Auto]	87
3.3.14 PCH Clock Skew [Auto]	87
3.3.15 Extreme OV [Disabled]	87
3.3.16 Full Phase Control [Full Phase]	87
3.3.17 Load-Line Calibration [Auto]	87
3.3.18 CPU Voltage Mode [VID]	87
3.3.19 CPU Voltage [Auto]	87
3.3.20 CPU PLL Voltage [Auto]	88
3.3.21 IMC Voltage [Auto]	88
3.3.22 PCH Voltage [Auto]	88
3.3.23 DRAM Voltage [Auto]	88
3.3.25 DRAM CTRL REF Voltage on CHA/B [Auto]	89
3.3.26 CPU Spread Spectrum [Auto]	89
3.3.27 PCIE Spread Spectrum [Auto]	89
3.3.28 ASUS O.C. Profile	89
3.4 Main menu	90
3.4.1 System Time [xx:xx:xx]	90
3.4.2 System Date [Day xx/xx/xxxx]	90
3.4.3 Language [English]	90
3.4.4 SATA 1–6	91
3.4.5 Storage Configuration	93
3.4.6 AHCI Configuration	94
3.4.7 System Information	94
3.5 Advanced menu	95
3.5.1 CPU Configuration	95
3.5.2 Chipset	98
3.5.3 Onboard Device Configuration	99
3.5.4 USB Configuration	100
3.5.5 LED Control	101
3.5.6 iROG Configuration	102
3.5.7 ROG Connect	102
3.6 Power menu	103
3.6.1 Suspend Mode [Auto]	103
3.6.2 Repost Video on S3 Resume [No]	103
3.6.3 ACPI 2.0 Support [Disabled]	103
3.6.4 ACPI APIC Support [Enabled]	104
3.6.5 EuP Ready [Disabled]	104
3.6.7 Hardware Monitor	106
3.7 Boot menu	109
3.7.1 Boot Device Priority	109
3.7.2 Boot Settings Configuration	110
3.7.3 Security	111
3.8 Tools menu	113
3.8.1 ASUS O.C. Profile	113
3.8.2 GO_Button File	114
3.8.3 AI NET 2	115
3.8.4 MemPerfect	116
3.8.5 ASUS EZ Flash 2	116
3.9 Exit menu	117
Chapter 4: Software support	119
4.1 Installing an operating system	121
4.2 Support DVD information	121
4.2.1 Running the support DVD	121
4.2.2 Drivers menu	122
4.2.3 Utilities menu	123
4.2.4 Make disk menu	124
4.2.5 Manual menu	125
4.2.6 Video menu	125
4.2.7 ASUS Contact information	126
4.2.8 Other information	126
4.3 Software information	128
4.3.1 Sound Blaster X-Fi audio utility	128
4.3.2 ASUS PC Probe II	132
4.3.3 ASUS AI Suite	138
4.3.4 ASUS Fan Xpert	140
4.3.5 ASUS EPU-6 Engine	141
4.3.6 TurboV EVO	142
4.4 RAID configurations	146
4.4.1 RAID definitions	146
4.4.2 Installing Serial ATA hard disks	147
4.4.3 Setting the RAID item in BIOS	147
4.4.4 Intel® Matrix Storage Manager option ROM utility	147
4.5 Creating a RAID driver disk	151
4.5.1 Creating a RAID driver disk without entering the OS	151
4.5.2 Creating a RAID driver disk in Windows®	151
4.5.3 Installing the RAID driver during Windows® OS installation	152
4.5.4 Using a USB floppy disk drive	152
Chapter 5: ATI® CrossFireX™ technology support	155
5.1 ATI® CrossFireX™ technology	157
5.1.1 Requirements	157
5.1.2 Before you begin	157
5.1.3 Installing CrossFireX graphics cards	158
5.1.4 Installing the device drivers	159
5.1.5 Enabling the ATI® CrossFireX™ technology	159
5.2 NVIDIA® SLI™ technology	161
5.2.1 Requirements	161
5.2.2 Installing two SLI-ready graphics cards	161
5.2.3 Installing the device drivers	162
5.2.4 Enabling the NVIDIA® SLI™ technology	162

Match case Limit results 1 per page

Maximus III GENE Motherboard Qualiﬁed Vendors Lists (QVL)

DDR3-2000MHz capability

Vendor

Part No.

Size

SS/

Chip

Brand

Chip NO.

Timing

Lable(Bios)

Voltage

DIMM socket

support

Apacer

78.0AGCQ.CBZ(XMP)

3GB (Kit of 3)

N/A

Heat-Sink Package

9-9-9-27(1066-8-8-8-20)

N/A

•

Crucial

BL12864BE2009.8SFB3(EPP)

1GB

N/A

Heat-Sink Package

9-9-9-28(1333-9-9-9-24)

•

G.SKILL

F3-16000CL7T-6GBPS(XMP)

6GB (Kit of 3)

N/A

Heat-Sink Package

7-8-7-20(1066-8-8-8-20)

1.65

•

G.SKILL

F3-16000CL9T-6GBPS(XMP)

6GB (Kit of 3)

N/A

Heat-Sink Package

9-9-9-24(1066-8-8-8-20)

1.65

•

KINGSTON

KHX16000D3K2/2GN(EPP)

2GB (Kit of 2)

N/A

Heat-Sink Package

2.0

•

KINGSTON

KHX16000D3K3/3GX(XMP)

3GB (Kit of 3)

N/A

Heat-Sink Package

9(1333-9-9-9-24)

1.65

•

KINGSTON

KHX16000D3ULT1K3/

6GX(XMP)

6GB (Kit 0f 3)

N/A

Heat-Sink Package

8(1066-8-8-8-20)

1.65

•

KINGSTON

KHX16000D3T1K3/6GX(XMP)

6GB (Kit of 3)

N/A

Heat-Sink Package

9(1066-8-8-8-20)

1.65

•

OCZ

OCZ3FXT20002GK

2GB (Kit of 2)

N/A

Heat-Sink Package

1.9

•

OCZ

OCZ3P20002GK(EPP)

2GB (Kit of 2)

N/A

Heat-Sink Package

1.9

•

OCZ

OCZ3P2000EB2GK

2GB (Kit of 2)

N/A

Heat-Sink Package

9-8-8(1066-8-7-7-20)

1.8

•

OCZ

OCZ3B2000LV6GK

6GB (Kit of 3)

N/A

Heat-Sink Package

7-8-7(1066-9-9-9-24)

1.65

•

Gingle

9CAASS37AZZ01D1

2GB

N/A

Heat-Sink Package

9-9-9-24

N/A

•

Maximus III GENE Motherboard Qualiﬁed Vendors Lists (QVL)

DDR3-2133MHz capability

Vendor

Part No.

Size

SS/

Chip

Brand

Chip NO.

Timing

Lable(Bios)

Voltage

DIMM socket support

G.SKILL

F3-17066CL9T-6GB-T

6GB (Kit of 3)

N/A

Heat-Sink Package

9-9-9-24(1066-8-7-7-20)

1.65

•

ASUS exclusively provides hyper DIMM support function.

•

Hyper DIMM support is subject to the physical characteristics of individual

CPUs.

•

According to Intel spec deﬁnition, DDR3-16�� is supported for one DIMM

per channel only. ASUS exclusively provides two DDR3-1600 DIMM

support for each memory channel.

•

Visit the ASUS website for the latest QVL.

Side(s): SS - Single-sided

DS - Double-sided

DIMM support:

•

A*:

Supports one (1) module inserted into slot A1 or B1 as Single-channel

memory conﬁguration.

•

B*:

Supports two (2) modules inserted into the blue slots (A1 and B1) as

one pair of Dual-channel memory conﬁguration.

•

C*:

Supports four (4) modules inserted into both the blue and the black

slots as two pairs of Dual-channel memory conﬁguration.

2-20

Chapter 2: Hardware information